Christopher P. Woodley, Rachel A. Cooper, Bart M. Bartlett
{"title":"通过改变镍基氧化还原偶的电位和抑制粒子粉碎,掺杂铜提高了 LiNi0.6Mn0.2Co0.2O2 (NMC622) 的容量保持率","authors":"Christopher P. Woodley, Rachel A. Cooper, Bart M. Bartlett","doi":"10.1021/acsaem.4c01450","DOIUrl":null,"url":null,"abstract":"To discern the influence of Cu<sup>2+</sup> as a dopant on both the structural and electrochemical characteristics of LiNi<sub>0.6</sub>Mn<sub>0.2</sub>Co<sub>0.2</sub>O<sub>2</sub> (NMC622), Cu<sup>2+</sup>(aq) was added to the coprecipitation synthesis from the constituent ions. At 5 mol % Cu<sup>2+</sup>, a single-phase Cu-NMC product results, evidenced by an increase in <i>d</i>-spacing along the [003] and [104] directions and a slight increase in the crystal volume of the <i>R</i>–3<i>m</i> hexagonal (rock-salt superstructure) lattice. XRD data and high-resolution TEM imaging support Cu<sup>2+</sup> doping primarily on the transition metal 3b Wyckoff sites. Galvanostatic cycling of Cu-NMC shows a reversible gravimetric capacity of 102 mAh/g compared to 136 mAh/g for undoped NMC. Despite the lower capacity, the discharge capacity retention of Cu-NMC is 89% after 100 cycles compared to only 70% for NMC. XPS analysis reveals that this lower capacity is due to an increase in the concentration of Ni<sup>3+</sup> ions at the surface, while XRD data collected at the top and bottom of charge show a smaller decrease in crystalline domain size for Cu-NMC (40.5% decrease) compared to NMC (74.7% decrease), translating to pulverization of the secondary particles.","PeriodicalId":5,"journal":{"name":"ACS Applied Materials & Interfaces","volume":null,"pages":null},"PeriodicalIF":8.3000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Cu Doping Increases Capacity Retention in LiNi0.6Mn0.2Co0.2O2 (NMC622) by Altering the Potential of the Ni-Based Redox Couple and Inhibiting Particle Pulverization\",\"authors\":\"Christopher P. Woodley, Rachel A. Cooper, Bart M. Bartlett\",\"doi\":\"10.1021/acsaem.4c01450\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To discern the influence of Cu<sup>2+</sup> as a dopant on both the structural and electrochemical characteristics of LiNi<sub>0.6</sub>Mn<sub>0.2</sub>Co<sub>0.2</sub>O<sub>2</sub> (NMC622), Cu<sup>2+</sup>(aq) was added to the coprecipitation synthesis from the constituent ions. At 5 mol % Cu<sup>2+</sup>, a single-phase Cu-NMC product results, evidenced by an increase in <i>d</i>-spacing along the [003] and [104] directions and a slight increase in the crystal volume of the <i>R</i>–3<i>m</i> hexagonal (rock-salt superstructure) lattice. XRD data and high-resolution TEM imaging support Cu<sup>2+</sup> doping primarily on the transition metal 3b Wyckoff sites. Galvanostatic cycling of Cu-NMC shows a reversible gravimetric capacity of 102 mAh/g compared to 136 mAh/g for undoped NMC. Despite the lower capacity, the discharge capacity retention of Cu-NMC is 89% after 100 cycles compared to only 70% for NMC. XPS analysis reveals that this lower capacity is due to an increase in the concentration of Ni<sup>3+</sup> ions at the surface, while XRD data collected at the top and bottom of charge show a smaller decrease in crystalline domain size for Cu-NMC (40.5% decrease) compared to NMC (74.7% decrease), translating to pulverization of the secondary particles.\",\"PeriodicalId\":5,\"journal\":{\"name\":\"ACS Applied Materials & Interfaces\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":8.3000,\"publicationDate\":\"2024-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Materials & Interfaces\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1021/acsaem.4c01450\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Materials & Interfaces","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsaem.4c01450","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Cu Doping Increases Capacity Retention in LiNi0.6Mn0.2Co0.2O2 (NMC622) by Altering the Potential of the Ni-Based Redox Couple and Inhibiting Particle Pulverization
To discern the influence of Cu2+ as a dopant on both the structural and electrochemical characteristics of LiNi0.6Mn0.2Co0.2O2 (NMC622), Cu2+(aq) was added to the coprecipitation synthesis from the constituent ions. At 5 mol % Cu2+, a single-phase Cu-NMC product results, evidenced by an increase in d-spacing along the [003] and [104] directions and a slight increase in the crystal volume of the R–3m hexagonal (rock-salt superstructure) lattice. XRD data and high-resolution TEM imaging support Cu2+ doping primarily on the transition metal 3b Wyckoff sites. Galvanostatic cycling of Cu-NMC shows a reversible gravimetric capacity of 102 mAh/g compared to 136 mAh/g for undoped NMC. Despite the lower capacity, the discharge capacity retention of Cu-NMC is 89% after 100 cycles compared to only 70% for NMC. XPS analysis reveals that this lower capacity is due to an increase in the concentration of Ni3+ ions at the surface, while XRD data collected at the top and bottom of charge show a smaller decrease in crystalline domain size for Cu-NMC (40.5% decrease) compared to NMC (74.7% decrease), translating to pulverization of the secondary particles.
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.