Wave scattering in a cracked exponentially graded magnetoelectroelastic half‐plane

An exponentially graded with respect to depth magnetoelectroelastic (MEE) half‐plane containing two line or curvilinear cracks under time‐harmonic SH wave is studied. The defined mechanical problem is described by boundary integral equations (BIEs) along the cracks boundaries. The computational tool based on the non‐hypersingular traction boundary integral equation method (BIEM) is developed, verified and inserted in numerical simulations. It is based on the analytically derived Green's function and free‐field wave motion solution for exponentially graded MEE half‐plane. The dependence of the generalized stress intensity factors (SIFs) on the material gradient parameters, on the dynamic load characteristics, on the cracks position and their shape, on the dynamic interaction between cracks and between them and half‐plane boundary is numerically analyzed.