单晶硅振动辅助微铣削综合实验研究

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
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引用次数: 0

摘要

本研究介绍了单晶硅振动辅助加工(VAM)技术的实验研究。作者介绍了一种新型高频二维振动辅助加工系统,该系统利用超声波高频进行槽铣实验。作为对比,实验中还使用了低频非共振振动辅助加工系统。实验深入研究了加工参数(包括进给速度、切削速度)和振动参数(包括振动模式和振幅)对加工性能的影响。使用扫描电子显微镜 (SEM) 分析了各种加工条件下的表面粗糙度、边缘崩边和刀具磨损情况。结果表明,在特定的加工和振动参数下,可以达到纳米级的表面粗糙度(Ra)。超声波振动辅助微铣削(UVAMM)系统具有更好的表面质量、更高的边缘质量和更低的刀具磨损。这项研究表明,振动辅助微铣削是生产硅元件的一项重要技术,其表面光洁度从几微米到纳米级不等,与传统加工(CM)相比提高了 144%。本文提出的二维 UVAMM 系统还为利用二维振动辅助加工系统实现卓越的加工效果提供了宝贵的启示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A comprehensive experimental investigation into vibration-assisted micro-milling of monocrystalline silicon

This study presents an experimental investigation of vibration-assisted machining (VAM) techniques for monocrystalline silicon. The author introduces a novel high-frequency two-dimensional vibration-assisted machining system which is used to conduct slot milling experiments using ultrasonic high-frequency. For comparison, a low-frequency non-resonant vibration-assisted machining system is also used in the experiments. The effects of machining parameters, including feedrate, cutting speeds, and vibration parameters, including vibration modes and amplitudes, on the machining performance are thoroughly investigated. The surface roughness, edge chipping generation, and tool wear under various machining conditions are characterised using scanning electron microscopy (SEM). The results show that, under specific machining and vibration parameters, a nanometric surface roughness (Ra) can be achieved. The ultrasonic vibration-assisted micro-milling (UVAMM) system is found to offer better surface quality, improved edge quality, and reduced tool wear. This study demonstrates that vibration-assisted micro-milling is a valuable technique for producing silicon components at scales ranging from a few microns with a nanometric surface finish with an improvement of 144 % compared to Conventional Machining (CM). The proposed 2D UVAMM system in this paper also provides valuable insight into the direction for utilizing 2D vibration-assisted machining systems to achieve superior machining results.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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