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公告栏：2024 年 IEEE DEIS 电气绝缘会议

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Electrical Insulation Magazine Pub Date : 2024-08-26 DOI:10.1109/MEI.2024.10646177
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引用次数: 0

摘要

2024 年电气绝缘会议（EIC 2024）于 2024 年 6 月 2 日至 6 日在美国明尼苏达州明尼阿波利斯市的美国购物中心雷迪森酒店举行。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Bulletin Board: IEEE DEIS Electrical Insulation Conference 2024
The 2024 Electrical Insulation Conference (EIC 2024) was held at the Radisson Blu Mall of America Hotel in Minneapolis, Minnesota, USA, between June 2 and 6, 2024.
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来源期刊
IEEE Electrical Insulation Magazine
IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气
CiteScore
4.60
自引率
3.40%
发文量
121
审稿时长
>12 weeks
期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.
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