{"title":"利用有限元分析 Inconel 718 在超声波振动辅助磨削过程中的表面微观结构演变","authors":"","doi":"10.1016/j.jmapro.2024.07.139","DOIUrl":null,"url":null,"abstract":"<div><p>In this study, a novel method for predicting microstructure evolution through secondary post-processing of finite element method (FEM) simulation results is proposed. This developed method integrates grinding process variables (strain <em>ε</em>, strain rate <span><math><mover><mi>ε</mi><mo>̇</mo></mover></math></span>, temperature <em>T</em>, stress <em>σ</em>, etc.) with the unified constitutive equations of Inconel 718 to calculate the distribution of normalized dislocation density <span><math><mover><mi>ρ</mi><mo>¯</mo></mover></math></span>, recrystallization volume fraction <em>S</em>, and grain size <em>d</em> at any frame time. Furthermore, the microstructure evolution during ultrasonic vibration-assisted grinding (UVAG) was analyzed under varying ultrasonic vibrations <em>A</em>, spindle speeds <em>n</em>, and grinding depths <em>a</em><sub>p</sub>. The research results indicate that the microstructure evolution mainly divided into three stages, resulting in the formation of refined grain region and high-density dislocation region in the ground surface layer. Ultrasonic vibration increases the depth of the refined grain region and the dislocation density in the ground surface layer, due to the strain increases and temperature decreases caused by periodic vibration. Additionally, increases in spindle speed and grinding depth leads to higher dislocation density, recrystallization fraction, and refine grain depth. The microstructures (dislocation density, depth of refine grain region) in the ground surface layer were characterized via transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD), and the experimental results verified the effectiveness of the developed method for predicting microstructure evolution. This method provides a new approach for understanding and controlling the microstructure evolution of the grinding surface of Inconel 718 during the UVAG process.</p></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":6.1000,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Surface microstructure evolution analysis of Inconel 718 during ultrasonic vibration-assisted grinding using FEM\",\"authors\":\"\",\"doi\":\"10.1016/j.jmapro.2024.07.139\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this study, a novel method for predicting microstructure evolution through secondary post-processing of finite element method (FEM) simulation results is proposed. This developed method integrates grinding process variables (strain <em>ε</em>, strain rate <span><math><mover><mi>ε</mi><mo>̇</mo></mover></math></span>, temperature <em>T</em>, stress <em>σ</em>, etc.) with the unified constitutive equations of Inconel 718 to calculate the distribution of normalized dislocation density <span><math><mover><mi>ρ</mi><mo>¯</mo></mover></math></span>, recrystallization volume fraction <em>S</em>, and grain size <em>d</em> at any frame time. Furthermore, the microstructure evolution during ultrasonic vibration-assisted grinding (UVAG) was analyzed under varying ultrasonic vibrations <em>A</em>, spindle speeds <em>n</em>, and grinding depths <em>a</em><sub>p</sub>. The research results indicate that the microstructure evolution mainly divided into three stages, resulting in the formation of refined grain region and high-density dislocation region in the ground surface layer. Ultrasonic vibration increases the depth of the refined grain region and the dislocation density in the ground surface layer, due to the strain increases and temperature decreases caused by periodic vibration. Additionally, increases in spindle speed and grinding depth leads to higher dislocation density, recrystallization fraction, and refine grain depth. The microstructures (dislocation density, depth of refine grain region) in the ground surface layer were characterized via transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD), and the experimental results verified the effectiveness of the developed method for predicting microstructure evolution. This method provides a new approach for understanding and controlling the microstructure evolution of the grinding surface of Inconel 718 during the UVAG process.</p></div>\",\"PeriodicalId\":16148,\"journal\":{\"name\":\"Journal of Manufacturing Processes\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":6.1000,\"publicationDate\":\"2024-08-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Manufacturing Processes\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1526612524008016\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524008016","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
摘要
本研究提出了一种通过对有限元法(FEM)模拟结果进行二次后处理来预测微观结构演变的新方法。该方法将磨削过程变量(应变ε、应变率ε、温度 T、应力σ等)与 Inconel 718 的统一构成方程相结合,计算出任意帧时间内归一化位错密度 ρ¯、再结晶体积分数 S 和晶粒尺寸 d 的分布。此外,还分析了超声振动辅助磨削(UVAG)过程中不同超声振动A、主轴转速n和磨削深度ap下的微观结构演变。研究结果表明,微观结构演变主要分为三个阶段,在磨削表面层形成细化晶粒区和高密度位错区。由于周期性振动导致应变增加和温度降低,超声波振动增加了细化晶粒区的深度和磨削表层的位错密度。此外,主轴转速和研磨深度的增加也会导致位错密度、再结晶分数和细化晶粒深度的增加。通过透射电子显微镜(TEM)和电子背散射衍射(EBSD)对磨削表面层的微观结构(位错密度、细化晶粒深度)进行了表征,实验结果验证了所开发方法在预测微观结构演变方面的有效性。该方法为了解和控制 Inconel 718 磨削表面在 UVAG 过程中的微观结构演变提供了一种新方法。
Surface microstructure evolution analysis of Inconel 718 during ultrasonic vibration-assisted grinding using FEM
In this study, a novel method for predicting microstructure evolution through secondary post-processing of finite element method (FEM) simulation results is proposed. This developed method integrates grinding process variables (strain ε, strain rate , temperature T, stress σ, etc.) with the unified constitutive equations of Inconel 718 to calculate the distribution of normalized dislocation density , recrystallization volume fraction S, and grain size d at any frame time. Furthermore, the microstructure evolution during ultrasonic vibration-assisted grinding (UVAG) was analyzed under varying ultrasonic vibrations A, spindle speeds n, and grinding depths ap. The research results indicate that the microstructure evolution mainly divided into three stages, resulting in the formation of refined grain region and high-density dislocation region in the ground surface layer. Ultrasonic vibration increases the depth of the refined grain region and the dislocation density in the ground surface layer, due to the strain increases and temperature decreases caused by periodic vibration. Additionally, increases in spindle speed and grinding depth leads to higher dislocation density, recrystallization fraction, and refine grain depth. The microstructures (dislocation density, depth of refine grain region) in the ground surface layer were characterized via transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD), and the experimental results verified the effectiveness of the developed method for predicting microstructure evolution. This method provides a new approach for understanding and controlling the microstructure evolution of the grinding surface of Inconel 718 during the UVAG process.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.