彻底改变生物吸附:人工智能驱动的纳米氧接触微生物封装技术

IF 8 2区 计算机科学 Q1 AUTOMATION & CONTROL SYSTEMS
Sara I. Abdelsalam , Noura Alsedais , Abdelraheem M. Aly
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引用次数: 0

摘要

本研究利用不可压缩平滑粒子流体力学(ISPH),研究了氧接触微生物在由纳米封装相变材料(NEPCM)填充的多孔环形空间中的生物对流。人工神经网络(ANN)与 ISPH 方法相结合,准确预测了平均 Nu‾ 值。在外部六角形畴和嵌入的波浪形圆柱体之间,产生了一个新的环面。相关参数范围为嵌入圆柱体的波幅 A=0.1-0.5,哈特曼数 Ha=0-80,圆柱体半径 Rcyld=0.05-0.5,达西数 Da=10-2-10-5,起伏数 Kund=2-32,生物对流瑞利数 Rab=1-1000,瑞利数 Ra=103-106,路易斯数 Le=1-20。研究发现,嵌入式波浪形圆柱体的规范几何特征,如波浪形振幅、圆柱体半径和起伏数,对扩大冷却区域和减少氧接触微生物有显著作用。因此,嵌入式波浪形圆柱体可用于冷却装置和热交换器等各种热用途。随着嵌入式圆柱体几何参数的增加,平均 Nu‾ 得到提高。瑞利/生物对流瑞利数的增加增强了加速速度场的浮力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Revolutionizing bioconvection: Artificial intelligence-powered nano-encapsulation with oxytactic microorganisms

Using incompressible smoothed particle hydrodynamics (ISPH), this study examines the bioconvection flow of oxytactic microorganisms in a porous annulus populated by nano-encapsulated phase change material (NEPCM). Artificial neural network (ANN) is joined with the ISPH method to accurately predict the values of average Nu. Between the outside hexagonal-shaped domain and the embedded wavy cylinder, a new annulus is produced. The ranges of the pertinent parameters are wave amplitude of an embedded cylinder A=0.10.5, Hartmann number Ha=080, a radius of the cylinder Rcyld=0.050.5, Darcy number Da=102105, undulation number Kund=232, bioconvection Rayleigh number Rab=11000, Rayleigh number Ra=103106, and Lewis number Le=120. The regulated geometric characteristics of an embedded wavy cylinder, such as wavy amplitude, cylinder radius, and undulation numbers, have been found to contribute significantly to widening the cooling region and minimizing the oxytactic microorganisms. Hence, the embedded wavy cylinder can be applied for various thermal uses including cooling devices and heat exchangers. The average Nu is enhanced under an increment in the geometric parameters of the embedded cylinder. Increasing Rayleigh/bioconvection Rayleigh numbers enhances the buoyancy forces that accelerate the velocity field.

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来源期刊
Engineering Applications of Artificial Intelligence
Engineering Applications of Artificial Intelligence 工程技术-工程:电子与电气
CiteScore
9.60
自引率
10.00%
发文量
505
审稿时长
68 days
期刊介绍: Artificial Intelligence (AI) is pivotal in driving the fourth industrial revolution, witnessing remarkable advancements across various machine learning methodologies. AI techniques have become indispensable tools for practicing engineers, enabling them to tackle previously insurmountable challenges. Engineering Applications of Artificial Intelligence serves as a global platform for the swift dissemination of research elucidating the practical application of AI methods across all engineering disciplines. Submitted papers are expected to present novel aspects of AI utilized in real-world engineering applications, validated using publicly available datasets to ensure the replicability of research outcomes. Join us in exploring the transformative potential of AI in engineering.
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