设计硅芯同轴 TSV 以减少 3D 集成电路应用中的串扰效应

IF 1.3 4区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IETE Journal of Research Pub Date : 2024-08-06 DOI:10.1080/03772063.2024.2385720

Krishna Pal, Bheemappa Halavar, V. Ramesh Kumar

引用次数: 0

摘要

本文介绍了基于铜（Cu）的同轴硅通孔（CTSV）在降低串扰噪声和传播延迟方面的有效性。在所提出的 CTSV 中，聚合物衬里被用于降低串扰噪声和传播延迟。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of Silicon Core Coaxial TSVs to Reduce Crosstalk Effects for 3D IC Applications

This paper presents the effectiveness of the copper (Cu)-based coaxial through silicon vias (CTSVs) to reduce crosstalk noise and propagation delay. In the proposed CTSVs, the polymer liners are us...

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来源期刊

IETE Journal of Research 工程技术-电信学

CiteScore

3.30

自引率

6.70%

发文量

308

期刊介绍： IETE Journal of Research is a Bimonthly journal published by the Institution of Electronics and Telecommunication Engineers (IETE), India. It publishes scientific and technical papers describing original research work or novel product/process development. Occasionally special issues are brought out on new and emerging research areas. IETE Journal of Research is useful to researchers, engineers, scientists, teachers, managers and students who are interested in keeping a track of original research and development work being carried out in the broad area of electronics, telecommunications, computer science and engineering and information technology.