Luis Alberto Tovar Ortiz;Miguel Hernández-Bolaños;Juan Carlos Herrera-Lozada;Israel Rivera-Zárate;Mauricio Olguín-Carbajal;Jacobo Sandoval-Gutierrez
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引用次数: 0
摘要
桥式起重机是一种工业机器,由于对其各个部件的检查存在缺陷,可能会导致用户事故。其中一项工作就是检查吊钩是否超过极限变形。然而,缺乏历史记录和忽视目视检查是确保正确维护服务的一个问题。因此,研究的目的是开发一种能够检查、记录和验证吊钩参数的视觉系统。该方法涉及在整体式起重机扫描系统上设计一个视觉模块。使用 ANSYS 对一个货钩的五态变形实验进行建模,并用 3D 打印技术进行制造,通过手动测量商用和专有视觉系统的参数来验证所提出的模块。两个系统在检测闩锁和正确位置方面的对比结果令人满意。最后,专有系统将钩子变形的分辨率提高到了 0.0435 毫米。有了这套系统的贡献,就有可能通过自动持续检测了解起重机吊钩的价值和安全寿命。
Development and comparison of a vision system for hook inspection on cranes
Overhead cranes are industrial machines that can cause user accidents due to deficiencies in inspecting their various components. One of the activities consists of verifying that the load hook does not exceed the limit deformation. However, the lack of historical records and negligence in visual inspection is a problem to ensure a correct maintenance service. Therefore, the objective of the research was to develop a vision system capable of inspecting, recording, and verifying the hook parameters. The method involved designing a vision module on an integral crane scanner system. A five-state deformation experiment of a cargo hook was modeled with ANSYS and fabricated in 3D printing to validate the proposed module by measuring the parameters manually with a commercial and proprietary vision system. The comparison between the two systems was satisfactory in detecting the latch and the correct position. Finally, the proprietary system improved the resolution up to 0.0435 mm on the hook deformation. With the systems contribution, it will be possible to know the valuable and safe life of the crane hook by automatic constant inspection.
期刊介绍:
IEEE Latin America Transactions (IEEE LATAM) is an interdisciplinary journal focused on the dissemination of original and quality research papers / review articles in Spanish and Portuguese of emerging topics in three main areas: Computing, Electric Energy and Electronics. Some of the sub-areas of the journal are, but not limited to: Automatic control, communications, instrumentation, artificial intelligence, power and industrial electronics, fault diagnosis and detection, transportation electrification, internet of things, electrical machines, circuits and systems, biomedicine and biomedical / haptic applications, secure communications, robotics, sensors and actuators, computer networks, smart grids, among others.