Guiyang Liu, Tinghong Gao, Jin Huang, Wanjun Yan, Quan Xie, Qingquan Xiao
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引用次数: 0
摘要
碳化硅(SiC)是第三代半导体材料,因其卓越的性能,在新能源汽车、航空航天和高速电子领域的应用举足轻重。本研究通过分子动力学模拟,深入研究了碳化硅晶体在 2700 至 3200 K 温度范围内的孪晶诱导生长行为,重点研究了碳化硅晶胞结构和锌混合晶胞结构,揭示了生长过程中的动态缺陷行为,包括空位的初始上升和随后的下降,并特别强调了锌混合晶胞孪晶层中的普遍缺陷。一个重要发现是温度与不同碳化硅结构的生长率之间存在直接关联,这凸显了温度控制对于优化晶体质量的重要性。此外,这项研究还有助于分析孪晶层的相互作用及其对碳化硅晶体结构稳定性和缺陷形成的影响。本文获得的见解对半导体行业具有重大意义,通过更好地控制基于碳化硅的电子和光电设备的生长条件和缺陷管理,有可能提高设备性能。
Exploring Defect Dynamics and Twin-Layer Interactions in SiC Crystals through Molecular Simulations.
Silicon carbide (SiC), a third-generation semiconductor material, is pivotal for applications in new energy vehicles, aerospace, and high-speed electronics, owing to its superior properties. This study delves into the twin-induced growth behaviors of SiC crystals through molecular dynamics simulations at temperatures ranging from 2700 to 3200 K. It focuses on the wurtzite and zinc blende SiC structures, revealing dynamic defect behavior during growth, including an initial rise and subsequent decrease in vacancies, with particular emphasis on prevalent defects within zinc blende twin layers. A significant finding is the direct correlation between temperature and growth rates across different SiC structures, highlighting temperature control as essential for optimizing crystal quality. Furthermore, this work contributes to the analysis of the interactions of twin layers and their impact on structural stability and defect formation in SiC crystals. The insights gained here have substantial implications for the semiconductor industry, potentially enhancing device performance by better controlling growth conditions and defect management in SiC-based electronic and optoelectronic devices.
期刊介绍:
An essential criterion for acceptance of research articles in the journal is that they provide new physical insight. Please refer to the New Physical Insights virtual issue on what constitutes new physical insight. Manuscripts that are essentially reporting data or applications of data are, in general, not suitable for publication in JPC B.