二维层状材料的各向异性蚀刻

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引用次数: 0

摘要

具有独特物理化学特性的二维(2D)层状材料,如石墨烯、过渡金属二掺杂物和六方氮化硼,在电气和电子工业以及社会领域都显示出巨大的潜力。要实现二维材料的实际应用,必须细化其尺寸、形状和边缘结构。蚀刻是半导体工业中的一个关键加工步骤,它作为一种高效的方法,在制造二维材料的各种纳米结构方面的潜力已得到证实,从而拓宽了二维材料在纳米电子学领域的应用。本文概述了各种二维材料各向异性蚀刻的最新进展。本文结合二维材料的合成、加工和表征,讨论了各向异性蚀刻及其相关机制。概述了各向异性蚀刻二维材料的应用。最后,讨论了二维材料各向异性蚀刻的挑战和未来机遇。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Anisotropic etching of 2D layered materials
Two-dimensional (2D) layered materials with unique physicochemical properties, such as graphene, transition metal dichalcogenides, and hexagonal boron nitride, have shown considerable potential in the electrical and electronics industries as well as society. To realize the practical applications of 2D materials, the size, shape, and edge structures must be refined. Etching is a critical processing step in the semiconducting industry and its potential as an efficient approach for fabricating diverse nanostructures of 2D materials has been demonstrated, broadening their applications in the field of nanoelectronics. In this paper, we present an overview of recent advances in anisotropic etching of various 2D materials. Anisotropic etching and the associated mechanisms are discussed in context of the synthesis, processing, and characterization of 2D materials. An overview of the applications of anisotropic etched 2D materials is provided. Finally, the challenges and future opportunities for anisotropic etching of 2D materials are discussed.
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