基于深度学习的芯片功耗预测与优化:智能 EDA 方法

Shikai Wang, Kangming Xu, Zhipeng Ling
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摘要

本文探讨了电子设计自动化(EDA)工具中深度学习技术的集成,重点是芯片功率预测和优化。我们研究了先进人工智能技术的应用,包括注意力机制、机器学习和生成式对抗网络 (GAN),以应对现代芯片设计中的复杂挑战。研究探讨了从传统的启发式方法向数据驱动方法的过渡,强调了显著提高设计效率和性能的潜力。我们介绍了案例研究,展示了人工智能驱动的 EDA 工具在功能验证、结果质量 (QoR) 预测和光学近似校正 (OPC) 布局生成方面的有效性。这项研究还解决了一些关键挑战,如模型的可解释性和广泛的经验验证需求。我们的研究结果表明,AI/ML 技术有可能彻底改变 EDA 工作流程,实现更高效的芯片设计并加速半导体行业的创新。论文最后讨论了未来的发展方向,包括在 EDA 工具中集成量子计算和神经形态架构。我们强调了人工智能专家与芯片设计人员合作研究的重要性,以充分发挥这些技术的潜力,应对先进节点设计中新出现的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep Learning-Based Chip Power Prediction and Optimization: An Intelligent EDA Approach
This paper explores the integration of deep learning techniques in Electronic Design Automation (EDA) tools, focusing on chip power prediction and optimization. We investigate the application of advanced AI technologies, including attention mechanisms, machine learning, and generative adversarial networks (GANs), to address complex challenges in modern chip design. The study examines the transition from traditional heuristic-based methods to data-driven approaches, highlighting the potential for significant improvements in design efficiency and performance. We present case studies demonstrating the effectiveness of AI-driven EDA tools in functional verification, Quality of Results (QoR) prediction, and Optical Proximity Correction (OPC) layout generation. The research also addresses critical challenges, such as model interpretability and the need for extensive empirical validation. Our findings suggest that AI/ML technologies have the potential to revolutionize EDA workflows, enabling more efficient chip designs and accelerating innovation in the semiconductor industry. The paper concludes by discussing future directions, including the integration of quantum computing and neuromorphic architectures in EDA tools. We emphasize the importance of collaborative research between AI experts and chip designers to fully realize the potential of these technologies and address emerging challenges in advanced node designs.
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