Lei Du, Yulong Li, Ruizhe Qiu, Jiaxing Xu, Kai Nie, Xinyu Cao, Jiaqi Tang, Yiqing Wang, Gang Du, Ling Bu
{"title":"用于人机界面应用的压电和三电自供电传感器的最新进展","authors":"Lei Du, Yulong Li, Ruizhe Qiu, Jiaxing Xu, Kai Nie, Xinyu Cao, Jiaqi Tang, Yiqing Wang, Gang Du, Ling Bu","doi":"10.1088/1361-6439/ad6778","DOIUrl":null,"url":null,"abstract":"\n The burgeoning internet of things (IoTs) and artificial intelligence (AI) technologies have prospered a variety of emerging applications. Human-machine interfaces (HMIs), for instance, enables users with intuitive, efficient, and friendly way to interact with machines, capable of instant information acquisition, processing, communication, and feedback, etc. These features require ultra-compact and high-performance transducers, and therefore self-powered sensors have become the key underlying technology for HMI applications. This review focuses on the piezoelectric, triboelectric, and hybrid self-powered sensors with particular attention to their microstructures and fabrication methods, showing that both traditional microfabrication and emerging fabrication methods like three-dimensional (3D) printing, electrospinning, and braiding have contributed to the planar, array, porous, fabric, and composite type self-powered sensors. Moreover, the integration method of piezoelectric and triboelectric sensor arrays (TSAs) is investigated. The crosstalk issue is highlighted, i.e. the signal interference between adjacent sensing units, and current solutions such as array design optimization, signal processing improvement, and material innovation to reduce crosstalk sensitivity have been reviewed through specific examples. Three categories of HMI applications have been outlined, including intelligent interaction, robotics, and human monitoring, with detailed explanations of how the self-powered sensors support these HMI applications. Through discussion of challenges and prospects, it is proposed that further coordinating the design and fabrication of micro devices with HMIs will potentially boost the intelligent application with even higher level of diversification, convenience, and interconnectivity.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":null,"pages":null},"PeriodicalIF":2.4000,"publicationDate":"2024-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Recent advances in piezoelectric and triboelectric self-powered sensors for human-machine interface applications\",\"authors\":\"Lei Du, Yulong Li, Ruizhe Qiu, Jiaxing Xu, Kai Nie, Xinyu Cao, Jiaqi Tang, Yiqing Wang, Gang Du, Ling Bu\",\"doi\":\"10.1088/1361-6439/ad6778\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The burgeoning internet of things (IoTs) and artificial intelligence (AI) technologies have prospered a variety of emerging applications. Human-machine interfaces (HMIs), for instance, enables users with intuitive, efficient, and friendly way to interact with machines, capable of instant information acquisition, processing, communication, and feedback, etc. These features require ultra-compact and high-performance transducers, and therefore self-powered sensors have become the key underlying technology for HMI applications. This review focuses on the piezoelectric, triboelectric, and hybrid self-powered sensors with particular attention to their microstructures and fabrication methods, showing that both traditional microfabrication and emerging fabrication methods like three-dimensional (3D) printing, electrospinning, and braiding have contributed to the planar, array, porous, fabric, and composite type self-powered sensors. Moreover, the integration method of piezoelectric and triboelectric sensor arrays (TSAs) is investigated. The crosstalk issue is highlighted, i.e. the signal interference between adjacent sensing units, and current solutions such as array design optimization, signal processing improvement, and material innovation to reduce crosstalk sensitivity have been reviewed through specific examples. Three categories of HMI applications have been outlined, including intelligent interaction, robotics, and human monitoring, with detailed explanations of how the self-powered sensors support these HMI applications. Through discussion of challenges and prospects, it is proposed that further coordinating the design and fabrication of micro devices with HMIs will potentially boost the intelligent application with even higher level of diversification, convenience, and interconnectivity.\",\"PeriodicalId\":16346,\"journal\":{\"name\":\"Journal of Micromechanics and Microengineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2024-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micromechanics and Microengineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6439/ad6778\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad6778","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Recent advances in piezoelectric and triboelectric self-powered sensors for human-machine interface applications
The burgeoning internet of things (IoTs) and artificial intelligence (AI) technologies have prospered a variety of emerging applications. Human-machine interfaces (HMIs), for instance, enables users with intuitive, efficient, and friendly way to interact with machines, capable of instant information acquisition, processing, communication, and feedback, etc. These features require ultra-compact and high-performance transducers, and therefore self-powered sensors have become the key underlying technology for HMI applications. This review focuses on the piezoelectric, triboelectric, and hybrid self-powered sensors with particular attention to their microstructures and fabrication methods, showing that both traditional microfabrication and emerging fabrication methods like three-dimensional (3D) printing, electrospinning, and braiding have contributed to the planar, array, porous, fabric, and composite type self-powered sensors. Moreover, the integration method of piezoelectric and triboelectric sensor arrays (TSAs) is investigated. The crosstalk issue is highlighted, i.e. the signal interference between adjacent sensing units, and current solutions such as array design optimization, signal processing improvement, and material innovation to reduce crosstalk sensitivity have been reviewed through specific examples. Three categories of HMI applications have been outlined, including intelligent interaction, robotics, and human monitoring, with detailed explanations of how the self-powered sensors support these HMI applications. Through discussion of challenges and prospects, it is proposed that further coordinating the design and fabrication of micro devices with HMIs will potentially boost the intelligent application with even higher level of diversification, convenience, and interconnectivity.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.