新型碳化硅 VD-MOSFET 在 JFET 区域采用优化的 P 型屏蔽结构,提高了短路稳健性

Zhijia Guo, Dongyuan Zhai, Jiwu Lu, Chunming Tu
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引用次数: 0

摘要

本文利用 TCAD 工具研究了碳化硅(SiC)垂直双扩散金属氧化物半导体场效应晶体管(VD-MOSFET)的短路特性。在传统 VD-MOSFET 框架的基础上,提出并设计了一种新型 900V SiC VD-MOSFET,即 PW-MOSFET,它在 JFET 区域引入了两个 P 型屏蔽层。与传统的 VD MOSFET 相比,PW-MOSFET 不仅能显著提高短路 (SC) 可靠性,还能优化静态性能。仿真结果表明,与传统的 VD-MOSFET 相比,PW-MOSFET 在直流链路电压为 600V 时的 SC 性能明显优于传统的 VD-MOSFET,短路耐受时间 (SCWT) 增加了 63%,Baliga 优越性图 (FOM) 增加了 25%。性能提升的关键因素在于 P 型屏蔽层的优势作用,它有利于调整电流流动路径,从而抑制饱和电流并提高短路事件的可靠性。此外,通过提高 JFET 区域的掺杂浓度,还解决了因引入 P 型屏蔽层而导致特性导通电阻(Ron、sp)增加的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel SiC VD-MOSFET with optimized P-type shielding structure in JFET region for improved short circuit robustness
This paper investigates the short-circuit characteristics of Silicon Carbide (SiC) Vertical Double-Diffused Metal-Oxide-Semiconductor Field-Effect Transistor (VD-MOSFET) utilizing TCAD tools. Expanding upon the conventional VD-MOSFET framework, a novel 900V SiC VD-MOSFET with two P-type shielding layer introduced in JFET region, PW-MOSFET, is proposed and designed. In contrast to the traditional VD MOSFET, PW- -MOSFET not only significantly improves short-circuit (SC) reliability but also optimizes static performance. Simulation results reveal that PW-MOSFET demonstrates notably superior SC performance at a DC link voltage of 600V compared to the traditional VD-MOSFET, with a 63% increase in Short-Circuit Withstand Time (SCWT) and a 25% enhancement in Baliga Figure of Merit (FOM). The key factor contributing to this performance enhancement is attributed to the advantageous role of the P-type shielding layer, facilitating adjustments in the current flow path, thereby suppressing saturation current and enhancing the reliability of short-circuit events. Furthermore, the issue of increased characteristic on-state resistance (Ron, sp) resulting from the introduction of the P-type shielding layer is addressed by augmenting the doping concentration in the JFET region.
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