使用广义二元参数同调算法的模糊扩展对含有不同纳米颗粒的 MHD 杰弗里-哈梅尔纳米流体流动进行数值研究

IF 3.7 2区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING
Verma Lalchand, Meher Ramakanta
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引用次数: 0

摘要

本研究利用广义二元参数同调算法的模糊扩展,考虑了两个刚性非平行平面壁之间含有铜、Al2O3 和 SiO2 等不同纳米颗粒的 MHD Jeffery-Hamel 纳米流体流动。纳米流体的配制增强了流体的热物理特性,包括热扩散率、传导率、对流传热系数和粘度。由于存在不同的纳米流体,体积分数值会发生变化,从而影响流动的速度曲线。纳米颗粒体积分数的短值被认为是一个不确定参数,用[0.0, 0.1, 0.2]之间的三角模糊数表示。这里使用了一种带有模糊扩展的新型广义二元参数同调算法来研究不同通道位置上的模糊速度。最后,通过与现有的简明计算结果进行比较,证明了所提方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical investigation on MHD Jeffery-Hamel nanofluid flow with different nanoparticles using fuzzy extension of generalized dual parametric homotopy algorithm

This study considers an MHD Jeffery-Hamel nanofluid flow with distinct nanoparticles such as copper, Al2O3 and SiO2 between two rigid non-parallel plane walls with the fuzzy extension of the generalized dual parametric homotopy algorithm. The nanofluids have been formulated to enhance the thermophysical characteristics of fluids, including thermal diffusivity, conductivity, convective heat transfer coefficients and viscosity. Due to the presence of distinct nanofluids, a change in the value of volume fraction occurs that influences the velocity profiles of the flow. The short value of nanoparticles volume fraction is considered an uncertain parameter and represented in a triangular fuzzy number range among [0.0, 0.1, 0.2]. A novel generalized dual parametric homotopy algorithm with fuzzy extension is used here to study the fuzzy velocities at various channel positions. Finally, the effectiveness of the proposed approach has been demonstrated through a comparison with the available results in the crisp case.

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来源期刊
Journal of Central South University
Journal of Central South University METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
6.10
自引率
6.80%
发文量
242
审稿时长
2-4 weeks
期刊介绍: Focuses on the latest research achievements in mining and metallurgy Coverage spans across materials science and engineering, metallurgical science and engineering, mineral processing, geology and mining, chemical engineering, and mechanical, electronic and information engineering
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