瞬态热负荷钨上伴随晶粒生长的宏观裂纹扩展

IF 0.8 4区 物理与天体物理 Q3 PHYSICS, MULTIDISCIPLINARY
Ki-Baek Roh, Myeong-Geon Lee, Kyung-Min Kim, Gon-Ho Kim
{"title":"瞬态热负荷钨上伴随晶粒生长的宏观裂纹扩展","authors":"Ki-Baek Roh,&nbsp;Myeong-Geon Lee,&nbsp;Kyung-Min Kim,&nbsp;Gon-Ho Kim","doi":"10.1007/s40042-024-01139-y","DOIUrl":null,"url":null,"abstract":"<div><p>The propagation of microcrack and grain growth in tungsten occurred at condition of transient heat loads was investigated experimentally, observing the effect on macrocrack development induced by stress intensification in time order. The temperature variation in short time, with frequency 30 Hz, heat flux 0.1 GWm<sup>−2</sup>, duration 2 ms at base temperature 1150 °C, induces fatigue fracture on the surface of tungsten, resulting in the formation of microcrack. Since the effective spatial temperature variation is limited to a few micron, microcrack is also occurred at the comparable depth. Following the initiation of microcrack, the grain growth propagation depth over time is measured and calculated based on the grain growth model with measuring the associated constants of the model. Within the grain growth layer, the degraded material properties at the microcrack tip lead to stress intensification which ultimately develop into macrocrack with order of millimeters. The study investigates that the subsurface microstructural changes in tungsten, caused by transient heat loads, have the potential to develop into macrocrack that extend into the deeper bulk area.</p></div>","PeriodicalId":677,"journal":{"name":"Journal of the Korean Physical Society","volume":null,"pages":null},"PeriodicalIF":0.8000,"publicationDate":"2024-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Macrocrack propagation with grain growth on transient heat loaded tungsten\",\"authors\":\"Ki-Baek Roh,&nbsp;Myeong-Geon Lee,&nbsp;Kyung-Min Kim,&nbsp;Gon-Ho Kim\",\"doi\":\"10.1007/s40042-024-01139-y\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The propagation of microcrack and grain growth in tungsten occurred at condition of transient heat loads was investigated experimentally, observing the effect on macrocrack development induced by stress intensification in time order. The temperature variation in short time, with frequency 30 Hz, heat flux 0.1 GWm<sup>−2</sup>, duration 2 ms at base temperature 1150 °C, induces fatigue fracture on the surface of tungsten, resulting in the formation of microcrack. Since the effective spatial temperature variation is limited to a few micron, microcrack is also occurred at the comparable depth. Following the initiation of microcrack, the grain growth propagation depth over time is measured and calculated based on the grain growth model with measuring the associated constants of the model. Within the grain growth layer, the degraded material properties at the microcrack tip lead to stress intensification which ultimately develop into macrocrack with order of millimeters. The study investigates that the subsurface microstructural changes in tungsten, caused by transient heat loads, have the potential to develop into macrocrack that extend into the deeper bulk area.</p></div>\",\"PeriodicalId\":677,\"journal\":{\"name\":\"Journal of the Korean Physical Society\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.8000,\"publicationDate\":\"2024-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of the Korean Physical Society\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s40042-024-01139-y\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"PHYSICS, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Korean Physical Society","FirstCategoryId":"101","ListUrlMain":"https://link.springer.com/article/10.1007/s40042-024-01139-y","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

摘要

实验研究了钨在瞬态热负荷条件下的微裂纹扩展和晶粒生长,观察了应力增强对大裂纹发展的影响。在基础温度为 1150 ℃、频率为 30 Hz、热通量为 0.1 GWm-2、持续时间为 2 ms 的短时间温度变化诱发了钨表面的疲劳断裂,导致微裂纹的形成。由于有效的空间温度变化仅限于几微米,因此微裂纹也出现在相当的深度。微裂纹产生后,根据晶粒生长模型,测量模型的相关常数,测量并计算出晶粒生长随时间的传播深度。在晶粒生长层内,微裂纹顶端退化的材料特性导致应力加剧,最终发展成毫米量级的大裂纹。该研究表明,瞬态热负荷导致的钨表层下微结构变化有可能发展成延伸至更深体积区域的宏观裂纹。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Macrocrack propagation with grain growth on transient heat loaded tungsten

Macrocrack propagation with grain growth on transient heat loaded tungsten

The propagation of microcrack and grain growth in tungsten occurred at condition of transient heat loads was investigated experimentally, observing the effect on macrocrack development induced by stress intensification in time order. The temperature variation in short time, with frequency 30 Hz, heat flux 0.1 GWm−2, duration 2 ms at base temperature 1150 °C, induces fatigue fracture on the surface of tungsten, resulting in the formation of microcrack. Since the effective spatial temperature variation is limited to a few micron, microcrack is also occurred at the comparable depth. Following the initiation of microcrack, the grain growth propagation depth over time is measured and calculated based on the grain growth model with measuring the associated constants of the model. Within the grain growth layer, the degraded material properties at the microcrack tip lead to stress intensification which ultimately develop into macrocrack with order of millimeters. The study investigates that the subsurface microstructural changes in tungsten, caused by transient heat loads, have the potential to develop into macrocrack that extend into the deeper bulk area.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of the Korean Physical Society
Journal of the Korean Physical Society PHYSICS, MULTIDISCIPLINARY-
CiteScore
1.20
自引率
16.70%
发文量
276
审稿时长
5.5 months
期刊介绍: The Journal of the Korean Physical Society (JKPS) covers all fields of physics spanning from statistical physics and condensed matter physics to particle physics. The manuscript to be published in JKPS is required to hold the originality, significance, and recent completeness. The journal is composed of Full paper, Letters, and Brief sections. In addition, featured articles with outstanding results are selected by the Editorial board and introduced in the online version. For emphasis on aspect of international journal, several world-distinguished researchers join the Editorial board. High quality of papers may be express-published when it is recommended or requested.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信