用于热感应应用的微加工多孔硅薄膜

IF 7.2 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Applied Materials Today Pub Date : 2024-07-16 DOI:10.1016/j.apmt.2024.102320

Pritam Sharma, Sobhan Erfantalab, John Dell, Giacinta Parish, Adrian Keating

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引用次数: 0

摘要

这项研究报告了一种新型的 CMOS 兼容微机械加工工艺，用于制造与硅基底电隔离的大孔硅膜。所开发的工艺成功解决了光刻胶渗入孔隙和薄膜在碱性显影剂中不稳定的难题。这些制备的薄膜可用作在长波长红外区域（LWIR）工作的非制冷热探测器的温度传感膜。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Micromachining porous silicon thin films for thermal sensing applications

This work reports a novel CMOS-compatible micromachining process to fabricate large porous silicon membranes which are electrically isolated from the silicon substrate. The process developed successfully addresses the challenges of photoresist seepage into pores and the instability of the films in alkaline developers. These fabricated membranes can be potentially used as a temperature sensing membrane in uncooled thermal detectors operating in long wavelength infrared region (LWIR).

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来源期刊

Applied Materials Today Materials Science-General Materials Science

CiteScore

14.90

自引率

3.60%

发文量

393

审稿时长

26 days

期刊介绍： Journal Name: Applied Materials Today Focus: Multi-disciplinary, rapid-publication journal Focused on cutting-edge applications of novel materials Overview: New materials discoveries have led to exciting fundamental breakthroughs. Materials research is now moving towards the translation of these scientific properties and principles.