用于先进微电子封装的纳米结构兼容互连器件

{"title":"用于先进微电子封装的纳米结构兼容互连器件","authors":"Waqas Saeed, Zhongyu Liu, Rubin Yan, Yuejun Li, Hongsheng Xu, Ye Tian, Xing Chen, Wei Liu","doi":"10.1016/j.matdes.2024.113166","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":506421,"journal":{"name":"Materials & Design","volume":"1 4","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nanostructured compliant interconnections for advanced Micro-Electronic packaging\",\"authors\":\"Waqas Saeed, Zhongyu Liu, Rubin Yan, Yuejun Li, Hongsheng Xu, Ye Tian, Xing Chen, Wei Liu\",\"doi\":\"10.1016/j.matdes.2024.113166\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":506421,\"journal\":{\"name\":\"Materials & Design\",\"volume\":\"1 4\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials & Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1016/j.matdes.2024.113166\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials & Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.matdes.2024.113166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}