接受免疫疗法的 NSCLC 患者中与高级别 irAEs 相关的基因突变

{"title":"接受免疫疗法的 NSCLC 患者中与高级别 irAEs 相关的基因突变","authors":"Margaret R. Smith, Yuezhu Wang, Caroline B. Dixon, Ralph D'Agostino, Yin Liu, Jimmy Ruiz, George C. Oliver, Lance D Miller, U. Topaloglu, Michael D. Chan, Michael Farris, Jing Su, K. Mileham, Wencheng Li, Jason M. Grayson, T. Lycan, Fei Xing","doi":"10.1016/j.cllc.2024.07.003","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mutations associated with high-grade irAEs in NSCLC patients receiving immunotherapies\",\"authors\":\"Margaret R. Smith, Yuezhu Wang, Caroline B. Dixon, Ralph D'Agostino, Yin Liu, Jimmy Ruiz, George C. Oliver, Lance D Miller, U. Topaloglu, Michael D. Chan, Michael Farris, Jing Su, K. Mileham, Wencheng Li, Jason M. Grayson, T. Lycan, Fei Xing\",\"doi\":\"10.1016/j.cllc.2024.07.003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2024-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"3\",\"ListUrlMain\":\"https://doi.org/10.1016/j.cllc.2024.07.003\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"3","ListUrlMain":"https://doi.org/10.1016/j.cllc.2024.07.003","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}