Modelling and simulation for the investigation on the ultrasonic propagation mechanism in advanced microelectronic packages

The miniaturisation, ultra-thinness and high-density multi-layer structure of advanced microelectronic packages complicate the propagation mechanism of ultrasonic waves. In this paper, a finite element model is used to simulate ultrasonic wave propagation in flip chip packages, investigating the laws of transmission and reflection at the lamination boundaries. The acoustic field of ultrasonic transducers is simulated using MATLAB and Abaqus software. The angular spectrum method (ASM) based on the Fourier transform is adopted to more precisely reveal the distribution characteristics and attenuation relationship of near‐field ultrasonic waves. The influence of the frequency and size of the ultrasonic transducer on the propagation characteristics of ultrasonic waves is analysed. Based on an acoustic field map generated by the detection model, the waveform conversions of acoustic waves in a multi-layer structure are analysed. The results show that ultrasonic waves are mainly presented in the form of reflected and transmitted waves at the layered interface and the model with a perfectly matched layer (PML) has higher accuracy. Therefore, this method is applied to ultrasonic testing in a flip chip package, which cannot only effectively exclude interference from boundary reflection but also greatly improve the reliability of waveform conversions analysis.