氧化铜纳米线的尺寸阈值:用于气体传感的微结构薄膜的生长研究

Nanomaterials Pub Date : 2024-07-16 DOI:10.3390/nano14141207
Christian Maier, V. Leitgeb, Larissa Egger, Anton Köck
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引用次数: 0

摘要

我们对从热氧化微结构铜薄膜中生长出氧化铜纳米线(CuO NW)进行了实验表征。我们系统地研究了铜层的厚度和尺寸对氧化铜纳米线合成的影响。我们的目标是确定最佳的铜层几何形状,以增加 CuO NW 的生长,从而直接在芯片上弥合相邻铜层结构之间的间隙,实现气体传感应用。根据 SEM 图像确定了 CuO-NW 生长在薄膜厚度和横向尺寸方面的阈值。薄膜厚度为 560 nm 时,长度大于 500 nm 的 NW 开始从面积≥ 4 µm2 的铜结构边缘生长。从面积≥ 16 µm2的上表面观察到了生长的 NW。对相邻热氧化薄膜之间的 NW 生长情况进行了分析。这项研究提供了有关氧化铜碳化钨生长最相关参数的信息,这对于将氧化铜碳化钨作为气体传感器元件直接集成到微芯片上至关重要。在此基础上,改变了结构的间隙大小,找到了 3 µm 的最佳值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Size-Dependent Thresholds in CuO Nanowires: Investigation of Growth from Microstructured Thin Films for Gas Sensing
An experimental characterization of cupric oxide nanowire (CuO NW) growth from thermally oxidized, microstructured Cu thin films is performed. We have systematically studied the influence of the thickness and dimension of Cu layers on the synthesis of CuO NW. The objective was to determine the optimum Cu geometries for increased CuO NWs growth to bridge the gap between adjacent Cu structures directly on the chip for gas sensing applications. Thresholds for CuO-NW growth regarding film thickness and lateral dimensions are identified based on SEM images. For a film thickness of 560 nm, NWs with lengths > 500 nm start to grow from the edges of Cu structures with an area ≥ 4 µm2. NWs growing from the upper surface were observed for an area ≥ 16 µm2. NW growth between adjacent thermally oxidized thin films was analyzed. The study provides information on the most relevant parameters of CuO NWs growth, which is mandatory for integrating CuO NWs as gas sensor components directly on microchips. Based on this result, the gap size of the structure was varied to find the optimum value of 3 µm.
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