{"title":"利用聚合物玻璃悬浮液和复制成型技术制造熔融石英半球形谐振器","authors":"Yahya Atwa, Hamza Shakeel","doi":"10.1088/1361-6439/ad5b6a","DOIUrl":null,"url":null,"abstract":"This work introduces a new method for manufacturing fused silica (FS)-based hemispherical resonators (HSRs) using a printable polymer glass mixture and replication molding. This process involves 3D printing to create the mold, followed by the casting of a photo-reactive pre-polymer glass mixture. This technique allows us to produce complex 3D geometries and offers faster production of resonators compared to other traditional methods. In this study, we manufactured three devices and successfully identified resonance modes with two (<italic toggle=\"yes\">N</italic> = 2), three (<italic toggle=\"yes\">N</italic> = 3) and four (<italic toggle=\"yes\">N</italic> = 4) nodes/antinodes in all three HSRs, demonstrating the repeatability of our new manufacturing method. The highest quality factor of 482 k was achieved for the <italic toggle=\"yes\">N</italic> = 3 resonance mode using the ring-down method. Some of the key advantages of our method include producing multiple devices efficiently with relatively good surface quality, making it a viable option for producing high-precision devices in the future. Our new fabrication technique results in a device surface roughness of ∼100 nm (measured over an area of 250 <italic toggle=\"yes\">μ</italic>m × 250 <italic toggle=\"yes\">μ</italic>m) and manufacturing yield of over 90%. Moreover, all the steps involved in this method can be completed outside of a specialized cleanroom environment.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"49 1","pages":""},"PeriodicalIF":2.4000,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Manufacturing fused silica hemispherical resonators using polymer glass suspension and replication molding\",\"authors\":\"Yahya Atwa, Hamza Shakeel\",\"doi\":\"10.1088/1361-6439/ad5b6a\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work introduces a new method for manufacturing fused silica (FS)-based hemispherical resonators (HSRs) using a printable polymer glass mixture and replication molding. This process involves 3D printing to create the mold, followed by the casting of a photo-reactive pre-polymer glass mixture. This technique allows us to produce complex 3D geometries and offers faster production of resonators compared to other traditional methods. In this study, we manufactured three devices and successfully identified resonance modes with two (<italic toggle=\\\"yes\\\">N</italic> = 2), three (<italic toggle=\\\"yes\\\">N</italic> = 3) and four (<italic toggle=\\\"yes\\\">N</italic> = 4) nodes/antinodes in all three HSRs, demonstrating the repeatability of our new manufacturing method. The highest quality factor of 482 k was achieved for the <italic toggle=\\\"yes\\\">N</italic> = 3 resonance mode using the ring-down method. Some of the key advantages of our method include producing multiple devices efficiently with relatively good surface quality, making it a viable option for producing high-precision devices in the future. Our new fabrication technique results in a device surface roughness of ∼100 nm (measured over an area of 250 <italic toggle=\\\"yes\\\">μ</italic>m × 250 <italic toggle=\\\"yes\\\">μ</italic>m) and manufacturing yield of over 90%. Moreover, all the steps involved in this method can be completed outside of a specialized cleanroom environment.\",\"PeriodicalId\":16346,\"journal\":{\"name\":\"Journal of Micromechanics and Microengineering\",\"volume\":\"49 1\",\"pages\":\"\"},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2024-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micromechanics and Microengineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6439/ad5b6a\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad5b6a","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Manufacturing fused silica hemispherical resonators using polymer glass suspension and replication molding
This work introduces a new method for manufacturing fused silica (FS)-based hemispherical resonators (HSRs) using a printable polymer glass mixture and replication molding. This process involves 3D printing to create the mold, followed by the casting of a photo-reactive pre-polymer glass mixture. This technique allows us to produce complex 3D geometries and offers faster production of resonators compared to other traditional methods. In this study, we manufactured three devices and successfully identified resonance modes with two (N = 2), three (N = 3) and four (N = 4) nodes/antinodes in all three HSRs, demonstrating the repeatability of our new manufacturing method. The highest quality factor of 482 k was achieved for the N = 3 resonance mode using the ring-down method. Some of the key advantages of our method include producing multiple devices efficiently with relatively good surface quality, making it a viable option for producing high-precision devices in the future. Our new fabrication technique results in a device surface roughness of ∼100 nm (measured over an area of 250 μm × 250 μm) and manufacturing yield of over 90%. Moreover, all the steps involved in this method can be completed outside of a specialized cleanroom environment.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.