硅砂中形成的蒸汽弧的瞬态淬火特性:气化二氧化硅混合物对直流电弧熄灭性能的贡献

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Naoto Kodama, Yasunobu Yokomizu, Waku Takenaka, Koya Nakamura
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This paper first carried out a 1000 A DC Cu arc quenching experiment using the silica-sand to obtain transient change in <span></span><math>\n <semantics>\n <mrow>\n <msub>\n <mi>r</mi>\n <mi>arc</mi>\n </msub>\n </mrow>\n <annotation>$$ {r}_{\\mathrm{arc}} $$</annotation>\n </semantics></math>, morphology of the arc, and arc temperature <span></span><math>\n <semantics>\n <mrow>\n <mi>T</mi>\n </mrow>\n <annotation>$$ T $$</annotation>\n </semantics></math> during the arc quenching process. As a result, a current decaying increased <span></span><math>\n <semantics>\n <mrow>\n <msub>\n <mi>r</mi>\n <mi>arc</mi>\n </msub>\n </mrow>\n <annotation>$$ {r}_{\\mathrm{arc}} $$</annotation>\n </semantics></math>. The arc was maintained in the cavity surrounded by the fulgurite during the current decaying process. The temperature of Cu/SiO<sub>2</sub> arc was 25–8 kK at a current region of 950–400 A during the arc quenching process. Second, we theoretically calculated an electrical resistivity <span></span><math>\n <semantics>\n <mrow>\n <mi>ρ</mi>\n </mrow>\n <annotation>$$ \\rho $$</annotation>\n </semantics></math>, and a thermal diffusivity <span></span><math>\n <semantics>\n <mrow>\n <mi>α</mi>\n </mrow>\n <annotation>$$ \\alpha $$</annotation>\n </semantics></math> as vapor properties for the Cu/SiO<sub>2</sub> vapor mixture. As typical results, the admixing of the SiO<sub>2</sub> vapor into the Cu arc less increased <span></span><math>\n <semantics>\n <mrow>\n <mi>ρ</mi>\n </mrow>\n <annotation>$$ \\rho $$</annotation>\n </semantics></math> of the Cu/SiO<sub>2</sub> vapor mixture at <span></span><math>\n <semantics>\n <mrow>\n <mi>T</mi>\n </mrow>\n <annotation>$$ T $$</annotation>\n </semantics></math> between 25 and 5 kK. The <span></span><math>\n <semantics>\n <mrow>\n <mi>ρ</mi>\n </mrow>\n <annotation>$$ \\rho $$</annotation>\n </semantics></math> of the Cu/SiO<sub>2</sub> vapor mixture drastically increased due to only decay in <span></span><math>\n <semantics>\n <mrow>\n <mi>T</mi>\n </mrow>\n <annotation>$$ T $$</annotation>\n </semantics></math>. In contrast, the admixing of the SiO<sub>2</sub> vapor into the Cu arc significantly increased <span></span><math>\n <semantics>\n <mrow>\n <mi>α</mi>\n </mrow>\n <annotation>$$ \\alpha $$</annotation>\n </semantics></math> at <span></span><math>\n <semantics>\n <mrow>\n <mi>T</mi>\n </mrow>\n <annotation>$$ T $$</annotation>\n </semantics></math> between 15 and 8 kK. 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The increased thermal energy dissipation due to the SiO<sub>2</sub> vapor admixing further decreases <span></span><math>\n <semantics>\n <mrow>\n <mi>T</mi>\n </mrow>\n <annotation>$$ T $$</annotation>\n </semantics></math> to rapidly rise <span></span><math>\n <semantics>\n <mrow>\n <mi>ρ</mi>\n </mrow>\n <annotation>$$ \\rho $$</annotation>\n </semantics></math> and <span></span><math>\n <semantics>\n <mrow>\n <msub>\n <mi>r</mi>\n <mi>arc</mi>\n </msub>\n </mrow>\n <annotation>$$ {r}_{\\mathrm{arc}} $$</annotation>\n </semantics></math> during the arc quenching process. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.</p>","PeriodicalId":13435,"journal":{"name":"IEEJ Transactions on Electrical and Electronic Engineering","volume":"19 12","pages":"1965-1975"},"PeriodicalIF":1.0000,"publicationDate":"2024-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Transient Quenching Properties of Vapor Arc Formed in Silica Sand: Contribution of Vaporized SiO2 Mixture to DC Arc Extinction Performance\",\"authors\":\"Naoto Kodama,&nbsp;Yasunobu Yokomizu,&nbsp;Waku Takenaka,&nbsp;Koya Nakamura\",\"doi\":\"10.1002/tee.24156\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The current-limiting fuse uses silica (SiO<sub>2</sub>)-sand as arc quenching medium to increase a current-limiting performance during the DC arc quenching process. 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As a result, a current decaying increased <span></span><math>\\n <semantics>\\n <mrow>\\n <msub>\\n <mi>r</mi>\\n <mi>arc</mi>\\n </msub>\\n </mrow>\\n <annotation>$$ {r}_{\\\\mathrm{arc}} $$</annotation>\\n </semantics></math>. The arc was maintained in the cavity surrounded by the fulgurite during the current decaying process. The temperature of Cu/SiO<sub>2</sub> arc was 25–8 kK at a current region of 950–400 A during the arc quenching process. Second, we theoretically calculated an electrical resistivity <span></span><math>\\n <semantics>\\n <mrow>\\n <mi>ρ</mi>\\n </mrow>\\n <annotation>$$ \\\\rho $$</annotation>\\n </semantics></math>, and a thermal diffusivity <span></span><math>\\n <semantics>\\n <mrow>\\n <mi>α</mi>\\n </mrow>\\n <annotation>$$ \\\\alpha $$</annotation>\\n </semantics></math> as vapor properties for the Cu/SiO<sub>2</sub> vapor mixture. 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引用次数: 0

摘要

限流熔断器使用二氧化硅(SiO2)砂作为熄弧介质,以提高直流熄弧过程中的限流性能。为了提高熔断器的限流性能,有必要详细了解电弧电阻的上升过程。本文首先使用硅砂进行了 1000 A 直流铜熄弧实验,以获得熄弧过程中电弧形态和电弧温度的瞬态变化。结果,电流衰减增加了 。在电流衰减过程中,电弧被保持在由红柱石包围的空腔中。熄弧过程中,在 950-400 A 电流区域,Cu/SiO2 电弧的温度为 25-8 kK。其次,我们从理论上计算了 Cu/SiO2 混合蒸汽的电阻率和热扩散率。典型的结果是,在 25 至 5 kK 的温度范围内,Cu/SiO2 蒸汽混合物在铜弧中的掺入量减少。相比之下,在 15 至 8 kK 时,SiO2 蒸汽掺入铜弧会显著增加。本研究结果表明,在电弧熄灭过程中,直流熔断器中混入铜弧的二氧化硅-砂蒸汽的主要作用是增加电弧的热能耗散并随之增加。在熄弧过程中,由于掺入二氧化硅蒸汽而增加的热能耗散会进一步减少并迅速上升。© 2024 日本电气工程师学会和 Wiley Periodicals LLC。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Transient Quenching Properties of Vapor Arc Formed in Silica Sand: Contribution of Vaporized SiO2 Mixture to DC Arc Extinction Performance

The current-limiting fuse uses silica (SiO2)-sand as arc quenching medium to increase a current-limiting performance during the DC arc quenching process. In order to increase the current-limiting performance of the fuse, a detailed understanding of an arc resistance r arc $$ {r}_{\mathrm{arc}} $$ rise process is necessary. This paper first carried out a 1000 A DC Cu arc quenching experiment using the silica-sand to obtain transient change in r arc $$ {r}_{\mathrm{arc}} $$ , morphology of the arc, and arc temperature T $$ T $$ during the arc quenching process. As a result, a current decaying increased r arc $$ {r}_{\mathrm{arc}} $$ . The arc was maintained in the cavity surrounded by the fulgurite during the current decaying process. The temperature of Cu/SiO2 arc was 25–8 kK at a current region of 950–400 A during the arc quenching process. Second, we theoretically calculated an electrical resistivity ρ $$ \rho $$ , and a thermal diffusivity α $$ \alpha $$ as vapor properties for the Cu/SiO2 vapor mixture. As typical results, the admixing of the SiO2 vapor into the Cu arc less increased ρ $$ \rho $$ of the Cu/SiO2 vapor mixture at T $$ T $$ between 25 and 5 kK. The ρ $$ \rho $$ of the Cu/SiO2 vapor mixture drastically increased due to only decay in T $$ T $$ . In contrast, the admixing of the SiO2 vapor into the Cu arc significantly increased α $$ \alpha $$ at T $$ T $$ between 15 and 8 kK. The present results indicate that an increase in α $$ \alpha $$ and consequent rise in thermal energy dissipation from the arc is the main role of the silica-sand vapor mixed with Cu arc in the DC fuse during the arc quenching process. The increased thermal energy dissipation due to the SiO2 vapor admixing further decreases T $$ T $$ to rapidly rise ρ $$ \rho $$ and r arc $$ {r}_{\mathrm{arc}} $$ during the arc quenching process. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

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来源期刊
IEEJ Transactions on Electrical and Electronic Engineering
IEEJ Transactions on Electrical and Electronic Engineering 工程技术-工程:电子与电气
CiteScore
2.70
自引率
10.00%
发文量
199
审稿时长
4.3 months
期刊介绍: IEEJ Transactions on Electrical and Electronic Engineering (hereinafter called TEEE ) publishes 6 times per year as an official journal of the Institute of Electrical Engineers of Japan (hereinafter "IEEJ"). This peer-reviewed journal contains original research papers and review articles on the most important and latest technological advances in core areas of Electrical and Electronic Engineering and in related disciplines. The journal also publishes short communications reporting on the results of the latest research activities TEEE ) aims to provide a new forum for IEEJ members in Japan as well as fellow researchers in Electrical and Electronic Engineering from around the world to exchange ideas and research findings.
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