通过浸入式旋转分离纯化工艺提高碲中痕量杂质的快速深度去除能力

Houyuan Zhang, Guoyu Qian, Jiachen Pang, Zhi Wang
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引用次数: 0

摘要

我们开发了一种浸入式旋转分离纯化(IRSP)工艺,通过驱动模具旋转来提高溶质和热量的传递效率,从而去除碲中的痕量杂质。模具旋转可在 2 分钟内增强杂质的大聚集。当模具转速为 400 rpm 时,Bi、Pb 和 Cu 的去除率分别为 93.9%、93.4% 和 89.6%。边界层变薄是实现高效杂质去除的关键因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Enhancing Rapid and Deep Removal of Trace Impurities from Tellurium by an Immersion Rotational Segregation Purification Process

Enhancing Rapid and Deep Removal of Trace Impurities from Tellurium by an Immersion Rotational Segregation Purification Process

An immersion rotational separation purification (IRSP) process is developed to remove trace impurities from tellurium by driving mold rotation to improve the efficiency of solute and heat transfer. Mold rotation can enhance the macrosegregation of impurities within 2 minutes. When the mold rotation speed is 400 rpm, the removal fraction of Bi, Pb and Cu were 93.9, 93.4 and 89.6 pct, separately. The thinning of boundary layer was a key factor for achieving efficient impurity removal.

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