在芯片组架构上设计高效的混合高速缓存一致性协议

Ruqing Wang, Lixin Yu, Zhuang Wei
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引用次数: 0

摘要

随着半导体技术的不断发展,单片集成面临着设计成本高、研发周期长等问题。芯片组通过将单个芯片拆分为多个具有不同功能的芯片,实现先进的封装集成,从而有效提高了良品率,缩短了研发周期。然而,与单片集成相比,芯片间通信受到引脚密度和物理距离的限制,芯片互连带来更高的延迟。同时,每个芯片都有独立的结构,访问相同的地址空间会导致系统级缓存一致性问题。因此,我们设计了基于目录的混合一致性协议的系统级高速缓存,并使用共享位和增加芯片间互连通道等优化策略来提高内核间一致性维护的效率。我们将 GEM5 与 SPLASH-2 基准相结合,与未经优化的基于目录的混合一致性协议进行比较。结果表明,程序运行速度提高了 19.3%,平均内存访问时间缩短了 23.3%,一致性协议流量减少了 37.8%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of an efficient hybrid cache coherence protocol on chiplet architecture
With the continuous development of semiconductor technology, monolithic integration faces problems such as high design costs and long research period. The chiplet effectively improves the yield rate and shortens the research and development cycle by splitting a single die into multiple dies with different functions for advanced packaging integration. However, compared to monolithic integration, inter-die communication is limited by pin density and physical distance, and die interconnects bring higher latency. At the same time, each die has an independent structure, and accessing the same address space will cause system-level cache coherence issues. Therefore, we design a system-level cache based on the directory-based hybrid consistency protocol, and use optimization strategies such as shared bit and add interconnection channels between dies to improve the efficiency of inter-core coherence maintenance. We use GEM5 in conjunction with the SPLASH-2 benchmark to compare with an unoptimized directory-based hybrid coherence protocol. The results show that the program running speed is increased by 19.3%, the average memory access time is reduced by 23.3%, and the consistency protocol traffic is reduced by 37.8%.
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