Kateryna Barynova, Martin Rudolph, S. Babu, J. Fischer, D. Lundin, M. Raadu, N. Brenning, Jon Tomas Gudmundsson
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In the case of a graphite target with argon as the working gas at 1 Pa, electron impact ionization (by both primary and secondary electrons) is the dominating contributor to working gas rarefaction, with over 90 % contribution, while the contribution of sputter wind kick-out is small < 10 %. In the case of copper and tungsten targets, the kick-out dominates, with up to ∼60 % contribution at 1 Pa. For metallic targets the kick-out is mainly due to metal atoms sputtered from the target, while for the graphite target the small kick-out contribution is mainly due to kick-out by hot argon atoms and to a smaller extent by carbon atoms. The main factors determining the relative contribution of the kick-out by the sputtered species to working gas rarefaction appear to be the sputter yield and the working gas pressure.","PeriodicalId":20192,"journal":{"name":"Plasma Sources Science and Technology","volume":"16 12","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On working gas rarefaction in high power impulse magnetron sputtering\",\"authors\":\"Kateryna Barynova, Martin Rudolph, S. Babu, J. Fischer, D. Lundin, M. Raadu, N. Brenning, Jon Tomas Gudmundsson\",\"doi\":\"10.1088/1361-6595/ad53fe\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The ionization region model (IRM) is applied to explore working gas rarefaction in high power impulse magnetron sputtering discharges operated with graphite, aluminum, copper, titanium, zirconium, and tungsten targets. For all cases the working gas rarefaction is found to be significant, the degree of working gas rarefaction reaches values of up to 83 %. The various contributions to working gas rarefaction, including electron impact ionization, kick-out by the sputtered species or hot argon atoms, and diffusion, are evaluated and compared for the different target materials, and over a range of discharge current densities. The relative importance of the various processes varies between different target materials. In the case of a graphite target with argon as the working gas at 1 Pa, electron impact ionization (by both primary and secondary electrons) is the dominating contributor to working gas rarefaction, with over 90 % contribution, while the contribution of sputter wind kick-out is small < 10 %. In the case of copper and tungsten targets, the kick-out dominates, with up to ∼60 % contribution at 1 Pa. For metallic targets the kick-out is mainly due to metal atoms sputtered from the target, while for the graphite target the small kick-out contribution is mainly due to kick-out by hot argon atoms and to a smaller extent by carbon atoms. The main factors determining the relative contribution of the kick-out by the sputtered species to working gas rarefaction appear to be the sputter yield and the working gas pressure.\",\"PeriodicalId\":20192,\"journal\":{\"name\":\"Plasma Sources Science and Technology\",\"volume\":\"16 12\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Plasma Sources Science and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6595/ad53fe\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasma Sources Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/1361-6595/ad53fe","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
电离区模型 (IRM) 被用于探索使用石墨、铝、铜、钛、锆和钨靶的高功率脉冲磁控溅射放电中的工作气体稀释。在所有情况下,工作气体稀释都非常显著,工作气体稀释程度高达 83%。针对不同的靶材料和放电电流密度范围,对工作气体稀释的各种贡献进行了评估和比较,其中包括电子撞击电离、溅射物质或热氩原子踢出以及扩散。各种过程的相对重要性因靶材而异。对于在 1 Pa 下以氩气为工作气体的石墨靶材,电子撞击电离(通过初级电子和次级电子)是造成工作气体稀释的主要因素,其贡献率超过 90%,而溅射风踢出的贡献率小于 10%。对于铜和钨靶来说,踢出是主要因素,在 1 Pa 时的贡献率高达 ∼ 60%。对于金属靶来说,踢出主要是由靶溅射出的金属原子造成的,而对于石墨靶来说,踢出的贡献率很小,主要是由热氩原子踢出造成的,碳原子踢出的贡献率较小。决定溅射物对工作气体稀释的相对贡献的主要因素似乎是溅射产量和工作气体压力。
On working gas rarefaction in high power impulse magnetron sputtering
The ionization region model (IRM) is applied to explore working gas rarefaction in high power impulse magnetron sputtering discharges operated with graphite, aluminum, copper, titanium, zirconium, and tungsten targets. For all cases the working gas rarefaction is found to be significant, the degree of working gas rarefaction reaches values of up to 83 %. The various contributions to working gas rarefaction, including electron impact ionization, kick-out by the sputtered species or hot argon atoms, and diffusion, are evaluated and compared for the different target materials, and over a range of discharge current densities. The relative importance of the various processes varies between different target materials. In the case of a graphite target with argon as the working gas at 1 Pa, electron impact ionization (by both primary and secondary electrons) is the dominating contributor to working gas rarefaction, with over 90 % contribution, while the contribution of sputter wind kick-out is small < 10 %. In the case of copper and tungsten targets, the kick-out dominates, with up to ∼60 % contribution at 1 Pa. For metallic targets the kick-out is mainly due to metal atoms sputtered from the target, while for the graphite target the small kick-out contribution is mainly due to kick-out by hot argon atoms and to a smaller extent by carbon atoms. The main factors determining the relative contribution of the kick-out by the sputtered species to working gas rarefaction appear to be the sputter yield and the working gas pressure.