通过送丝快速成型技术开发铁-铬-铝合金

IF 0.8 4区 物理与天体物理 Q4 PHYSICS, APPLIED
Yanhu Wang, Xizhang Chen, S. Konovalov
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引用次数: 0

摘要

摘要 一种基于冷金属转移(CMT)焊接工艺的新型线弧增材制造(WAAM)被用于通过同时送入两根独立的金属丝来制造铁铬铝合金(Fe-Cr-Al)。在钢基体上沉积了含铝约 4.2% 和含铬约 6.5% 的铁铬铝合金壁。对沉积合金进行的化学成分测试表明,整个沉积壁的材料元素分布均匀。此外还发现,增加铝含量或减少铬含量可提高铁铬铝合金的硬度。宏观和微观结构特征显示,合金壁的顶部区域包含等轴晶粒,而中部区域则为柱状晶粒,底部则有一些 Fe3AlC0.5 相的针状沉淀。砌墙内不同位置的相位差异很大,尤其是在顶部和底部。在顶部和中部发现了 Fe3C 碳化物。在顶部发现了 Cr3C2 碳化物。在堆积壁底部没有发现 (Cr,Fe)xCy 碳化物。底部和顶部的比较表明,(Fe,Cr)xCy 碳化物具有防止裂纹产生的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Fe–Cr–Al Alloy Development Via Wire-Feed Additive Manufacturing Technology

Fe–Cr–Al Alloy Development Via Wire-Feed Additive Manufacturing Technology

Fe–Cr–Al Alloy Development Via Wire-Feed Additive Manufacturing Technology

A new wire-arc additive manufacturing (WAAM) based on Cold Metal Transfer (CMT) welding process is used to fabricate iron-chromium-aluminum (Fe–Cr–Al) alloy by simultaneously feeding two separate wires. A wall of Fe–Cr–Al containing approximately 4.2% Al and 6.5% Cr was deposited over a steel substrate. Chemical composition test performed on the deposited alloy indicated a uniform material distribution of element throughout the deposited wall. It was also found that an increase in Al content or decrease in Cr content improved the hardness of the Fe–Cr–Al alloy. A macro and microstructural characterization revealed that the top region of the wall contained equiaxed grains, whereas columnar grain in the middle region and some acicular precipitates of Fe3AlC0.5 phase at the bottom were observed. The phases at different locations within the built wall were very different, especially, in the top section and bottom section. In the top and middle sections Fe3C carbide were found. The Cr3C2 carbides were found in the top section. No (Cr,Fe)xCy carbides were found at the bottom of the buildup wall. A comparison of bottom and top sections indicated that the (Fe,Cr)xCy carbides have the ability to prevent cracks from occurring.

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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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