通过交集子空间构建最优二进制局部可修复代码

IF 7.3 2区 计算机科学 Q1 COMPUTER SCIENCE, INFORMATION SYSTEMS
Wenqin Zhang, Deng Tang, Chenhao Ying, Yuan Luo
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引用次数: 0

摘要

局部可修复代码(LRC)只需读取少量其他符号即可恢复编码词的任何符号,已广泛应用于微软 Azure 存储和 Ceph 存储集群等实际分布式存储系统。由于二进制线性 LRC 可以大大降低编码和解码的复杂性,因此二进制 LRC 的构造尤其引人关注。本文旨在构建具有不相交局部修复组的维度最优二元线性 LRC。我们介绍了一种将交集子空间与二进制 LRC 连接起来的方法,并通过利用直接相加推导出的交集子空间,构建局部性为 2b (b ≽ 3) 和最小距离 d ≽ 6 的维度最优二进制线性 LRC。与所有已知的最小距离 d ≽ 6 和局部性 2b 的二元线性 LRC 相比,这种方法将充分增加维度最优 LRC 的可能修复组的数量,从而有效地扩大构造参数的范围,同时保持最大的编码率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Constructions of optimal binary locally repairable codes via intersection subspaces

Locally repairable codes (LRCs), which can recover any symbol of a codeword by reading only a small number of other symbols, have been widely used in real-world distributed storage systems, such as Microsoft Azure Storage and Ceph Storage Cluster. Since binary linear LRCs can significantly reduce coding and decoding complexity, constructions of binary LRCs are of particular interest. The aim of this paper is to construct dimensional optimal binary LRCs with disjoint local repair groups. We introduce a method to connect intersection subspaces with binary LRCs and construct dimensional optimal binary linear LRCs with locality 2b (b ≽ 3) and minimum distance d ≽ 6 by employing intersection subspaces deduced from the direct sum. This method will sufficiently increase the number of possible repair groups of dimensional optimal LRCs, thus efficiently expanding the range of the construction parameters while keeping the largest code rates compared with all known binary linear LRCs with minimum distance d ≽ 6 and locality 2b.

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来源期刊
Science China Information Sciences
Science China Information Sciences COMPUTER SCIENCE, INFORMATION SYSTEMS-
CiteScore
12.60
自引率
5.70%
发文量
224
审稿时长
8.3 months
期刊介绍: Science China Information Sciences is a dedicated journal that showcases high-quality, original research across various domains of information sciences. It encompasses Computer Science & Technologies, Control Science & Engineering, Information & Communication Engineering, Microelectronics & Solid-State Electronics, and Quantum Information, providing a platform for the dissemination of significant contributions in these fields.
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