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倒装芯片中 Ag-2.5Sn 焊点的热疲劳寿命预测

IF 2.7 4区 材料科学 Q3 ENGINEERING, CHEMICAL
Journal of Adhesion Science and Technology Pub Date : 2024-04-30 DOI:10.1080/01694243.2024.2345955
Hui Yang, Zhengyu Xu
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引用次数: 0

摘要

随着微电子互连技术的快速发展，传统的填料焊料已无法满足大功率设备的散热需求。除了要满足大功率设备的散热需求外，传统的填料焊料还必须具有较高的耐热性。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Thermal fatigue life prediction of Ag-2.5Sn solder joint in flip chip
The heat dissipation needs of high-power devices cannot now be met by traditional packing solders due to the fast development of microelectronics interconnect technology. In addition to having outs...
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来源期刊
Journal of Adhesion Science and Technology
Journal of Adhesion Science and Technology 工程技术-材料科学：综合
CiteScore
5.10
自引率
13.00%
发文量
136
审稿时长
4.1 months
期刊介绍： Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.
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