在 Eu-Ba-Cu-O 块状单晶粒超导体之间制造低电阻接头的途径

J V J Congreve, Y Shi, N C Tutt, R W Taylor, C Bumby, A R Dennis, H Druiff, D Weerakonda Arachchilage, J H Durrell and D A Cardwell
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摘要

目前,制造具有许多实际应用所需的复杂几何形状的大型(RE)-Ba-Cu-O 单晶粒[(RE)BCO](其中 RE = Y、Gd、Eu 或 Sm)受到了晶粒生长过程的时间密集性和复杂性的限制。此外,使用成熟的熔融加工技术(如顶籽熔融生长)所能获得的形状,也因现成的后处理技术数量有限而受到很大限制。由于这些材料具有类似陶瓷的机械特性,因此既脆又硬,因此加工起来也很困难。除了缓慢而缺乏灵活性的熔融生长过程之外,一种可能的替代方法是将许多小的单个晶粒连接起来,形成一个大的复合晶粒,并通过电气和机械性能高的接头连接起来。可靠的连接技术还能大大减少对生长后加工工艺的需求。在这项工作中,我们扩展了之前的研究,即使用单晶粒 YBCO-Ag 作为中间连接材料,在 EuBCO-Ag 体、单晶粒超导体之间实现有效、可靠的超导连接。早期研究中报告的技术只需要有限的专业设备,不需要严格的工艺参数控制,因为不需要在晶粒间界面重新生长连接材料。由于块体超导体和中间接合材料的筑构温度相差很大,因此这种技术特别值得关注。我们报告了在不同接合温度下设计的七个接合点的特性。我们测量了接合样品的陷场特性,并检查了接合位置的微观结构。我们证明,这种简单快速的接合技术可以在工业上重要的 (RE)BCO 体超导体中制造出复合晶粒,其超导特性与尺寸相似的单个晶粒相当。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A route to fabricate low resistance joints between Eu–Ba–Cu–O bulk, single grain superconductors
The fabrication of large (RE)–Ba–Cu–O single grains [(RE)BCO], where RE = Y, Gd, Eu or Sm, with the complex geometries required for many practical applications is currently limited by the time intensive, complex nature of the grain growth process. In addition, the shapes achievable using established melt processing techniques, such as top seeded melt growth, are constrained significantly by the limited number of post-processing techniques readily available. Machining of these materials is also difficult given their ceramic-like mechanical properties, which makes them both brittle and hard. A potential alternative to the slow and inflexible melt growth processes is to join many small, single grains to form one large composite grain, connected by electrically and mechanically high-performance joints. A reliable joining technique would also greatly reduce the need for post-growth machining processes. In this work we extend our previous investigation of the use of single grain YBCO-Ag as an intermediate joining material to achieve effective and reliable superconducting joints between EuBCO-Ag bulk, single grain superconductors. The technique reported in the earlier studies requires limited specialist equipment and does not require tight process parameter control, since there is no need to re-grow the joining material at the intergrain interface. This technique is of particular interest given that the difference between the peritectic temperatures of the bulk superconductor and the intermediate joining material is large. We report the properties of seven joints engineered at different joining temperatures. The trapped field properties of the resulting joined samples were measured and the microstructure at the position of the joint examined. We demonstrate that this simple and the rapid joining technique makes it possible to manufacture composite grains in an industrially important (RE)BCO bulk superconductor with comparable superconducting properties to those of a single grain of similar dimensions.
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