PCI-Express:无处不在的负载存储互连二十年来的发展和未来二十年的前进之路

IF 5.6 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Debendra Das Sharma
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引用次数: 0

摘要

二十多年来,外设组件互连 Express(PCI-Express 或 PCle)架构一直是不断发展的计算领域中无处不在的主干互连架构。本文深入探讨了推动 PCle 向后兼容演进的多种创新技术,这些创新技术已历经七代,每一代的带宽都翻了一番,同时还提供了高能效和高成本效益的性能。Compute Express Link(CXL)在 PCle 的基础上叠加了一致性和内存协议,用于异构计算、解决内存墙问题、跨服务器的资源池和共享,以及使用基于负载存储的消息传递进行分布式计算。通用芯片组互连 Express $^{TM}$ (UCle)是芯片组的行业标准,它在带宽密度、能效和延迟方面为 PCle 和 CXL 协议提供了数量级的改进。我们预计 PCle 将在未来几十年继续发展,以满足未来的计算需求。它将通过采用替代介质来实现这一目标,同时将继续实现与铜缆向后兼容的频率扩展,而协议增强功能将支持非树状结构拓扑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PCI-Express: Evolution of a Ubiquitous Load-Store Interconnect Over Two Decades and the Path Forward for the Next Two Decades
The Peripheral Component Interconnect Express (PCI-Express or PCle) architecture has been the ubiquitous backbone interconnect in the evolving computing landscape for more than two decades. This paper delves into the multiple innovations driving the backward-compatible evolution of PCle for seven generations, doubling bandwidth every generation, while delivering power-efficient and cost-effective performance. Compute Express Link (CXL) overlays coherency and memory protocols on top of PCle for heterogeneous computing, addressing the memory wall, resource pooling and sharing across servers, and distributed computing using load-store based messaging. The die-todie industry-standard, Universal Chiplet Interconnect Express $^{TM}$ (UCle), offers orders of magnitude improvement in bandwidth density, power efficiency, and latency for PCle and CXL protocols on-package and pod-level connectivity with co-packaged optics. We foresee PCle will continue to evolve over the next few decades to serve future computing needs. It will do so by embracing alternate media while backward-compatible frequency scaling with copper will continue and protocol enhancements will enable non-tree fabric topologies.
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来源期刊
IEEE Circuits and Systems Magazine
IEEE Circuits and Systems Magazine 工程技术-工程:电子与电气
CiteScore
9.30
自引率
1.40%
发文量
34
审稿时长
>12 weeks
期刊介绍: The IEEE Circuits and Systems Magazine covers the subject areas represented by the Society's transactions, including: analog, passive, switch capacitor, and digital filters; electronic circuits, networks, graph theory, and RF communication circuits; system theory; discrete, IC, and VLSI circuit design; multidimensional circuits and systems; large-scale systems and power networks; nonlinear circuits and systems, wavelets, filter banks, and applications; neural networks; and signal processing. Content also covers the areas represented by the Society technical committees: analog signal processing, cellular neural networks and array computing, circuits and systems for communications, computer-aided network design, digital signal processing, multimedia systems and applications, neural systems and applications, nonlinear circuits and systems, power systems and power electronics and circuits, sensors and micromaching, visual signal processing and communication, and VLSI systems and applications. Lastly, the magazine covers the interests represented by the widespread conference activity of the IEEE Circuits and Systems Society. In addition to the technical articles, the magazine also covers Society administrative activities, as for instance the meetings of the Board of Governors, Society People, as for instance the stories of award winners-fellows, medalists, and so forth, and Places reached by the Society, including readable reports from the Society's conferences around the world.
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