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用于电路板的再生蚀刻解决方案，同时提取铜

IF 1.3 Q4 ENGINEERING, ENVIRONMENTAL
Journal of Ecological Engineering Pub Date : 2024-05-01 DOI:10.12911/22998993/186504
Аnatoliy Nester, Tetiana Yakovyshyna, Ivan Salamon, Lesya Sheludchenko, O. Liubynskyi, Olga Romanishina, Elvira Dzhumelia
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引用次数: 0

摘要

对电镀生产、印刷电路板生产过程中产生的污泥进行检测
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Regenerating Etching Solutions for Circuit Boards while Extracting Copper
The examination of sludge derived from electroplating manufacturing, printed circuit board production
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来源期刊
Journal of Ecological Engineering
Journal of Ecological Engineering ENGINEERING, ENVIRONMENTAL-
CiteScore
2.60
自引率
15.40%
发文量
379
审稿时长
8 weeks
期刊介绍： - Industrial and municipal waste management - Pro-ecological technologies and products - Energy-saving technologies - Environmental landscaping - Environmental monitoring - Climate change in the environment - Sustainable development - Processing and usage of mineral resources - Recovery of valuable materials and fuels - Surface water and groundwater management - Water and wastewater treatment - Smog and air pollution prevention - Protection and reclamation of soils - Reclamation and revitalization of degraded areas - Heavy metals in the environment - Renewable energy technologies - Environmental protection of rural areas - Restoration and protection of urban environment - Prevention of noise in the environment - Environmental life-cycle assessment (LCA) - Simulations and computer modeling for the environment
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