硅晶片抛光过程中边缘形状的变化：卷边和卷起的形成

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.04.032

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引用次数: 0

摘要

硅晶片的边缘形状对于优化设备制造至关重要。在抛光工艺中，必须根据工艺的具体要求，将硅片加工成平面或卷边形状。然而，传统工艺通常会产生卷边形状。本研究确定了影响抛光过程中边缘形状变化的因素。通过抛光实验，研究了初始边缘形状以及晶片和抛光垫之间的接触状态对去除分布的影响。并提出了调整所产生的边缘形状的方法。

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Changes in edge shape during silicon wafer polishing: Roll-off and roll-up formation

The edge shape of a silicon wafer is crucial for optimal device manufacturing. In polishing processes, it is necessary to form wafers into either a flat or roll-up shape, depending on the specific requirements of the process. However, the conventional process typically results in a roll-off shape. This study identifies the factors that influence a change in the edge shape during polishing. Polishing experiments were conducted to examine the effects of the initial edge shape and contact state between the wafer and polishing pad on the removal distribution. An approach for adjusting the resulting edge shapes was proposed.

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来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.