Exploring the structural mechanics of titanium nickel solid alloy using COMSOL Multiphysics: A Poisson equation and continuity equation perspective

This study investigates the structural mechanics of titanium-nickel (Ti-Ni) alloy thin film using computational modelling through COMSOL Multiphysics based on Poisson’s equation and continuity equation for stress check by considering its linear elastic, conservation of charge and providing insight into nanomaterial deformation. In the COMSOL environment the parameters for titanium nickel (Ti-Ni) are embedded in the COMSOL Simulink interface. The Thin film layer was designed by defining the layer geometry of the size and shape of the layer with a width of 500 μm, depth of 200 μm and height of 3 μm subjected to boundary conditions such as von – mises stress, surface temperature, iso-surface temperature, multi-slice electric potential, displacement component, surface elastic strain energy density and total enthalpy. The results displayed a trend that is, as the surface temperature increases there will be an increase in the current densities associated with high electrical conduction. On the same note, the designed thin film layer will pass the percolation threshold. The results of surface elastic strain energy density and total enthalpy imply that the designed thin film layer is effective and efficient as a structural pseudopotential device (photodiode).