{"title":"二维集成红外光电的热载流子工程","authors":"Yuanfang Yu, Jialin Zhang, Lianhui Wang, Zhenhua Ni, Junpeng Lu, Li Gao","doi":"10.1002/inf2.12556","DOIUrl":null,"url":null,"abstract":"<p>Plasmonic hot carrier engineering holds great promise for advanced infrared optoelectronic devices. The process of hot carrier transfer has the potential to surpass the spectral limitations of semiconductors, enabling detection of sub-bandgap infrared photons. By harvesting hot carriers prior to thermalization, energy dissipation is minimized, leading to highly efficient photoelectric conversion. Distinguished from conventional band-edge carriers, the ultrafast interfacial transfer and ballistic transport of hot carriers present unprecedented opportunities for high-speed photoelectric conversion. However, a complete description on the underlying mechanism of hot-carrier infrared optoelectronic device is still lacking, and the utilization of this strategy for tailoring infrared response is in its early stages. This review aims to provide a comprehensive overview of the generation, transfer and transport dynamics of hot carriers. Basic principles of hot-carrier conversion in heterostructures are discussed in detail. In addition, progresses of two-dimensional (2D) infrared hot-carrier optoelectronic devices are summarized, with a specific emphasis on photodetectors, solar cells, light-emitting devices and novel functionalities through hot-carrier engineering. Furthermore, challenges and prospects of hot-carrier device towards infrared applications are highlighted.\n <figure>\n <div><picture>\n <source></source></picture><p></p>\n </div>\n </figure></p>","PeriodicalId":48538,"journal":{"name":"Infomat","volume":null,"pages":null},"PeriodicalIF":22.7000,"publicationDate":"2024-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/inf2.12556","citationCount":"0","resultStr":"{\"title\":\"Hot-carrier engineering for two-dimensional integrated infrared optoelectronics\",\"authors\":\"Yuanfang Yu, Jialin Zhang, Lianhui Wang, Zhenhua Ni, Junpeng Lu, Li Gao\",\"doi\":\"10.1002/inf2.12556\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Plasmonic hot carrier engineering holds great promise for advanced infrared optoelectronic devices. The process of hot carrier transfer has the potential to surpass the spectral limitations of semiconductors, enabling detection of sub-bandgap infrared photons. By harvesting hot carriers prior to thermalization, energy dissipation is minimized, leading to highly efficient photoelectric conversion. Distinguished from conventional band-edge carriers, the ultrafast interfacial transfer and ballistic transport of hot carriers present unprecedented opportunities for high-speed photoelectric conversion. However, a complete description on the underlying mechanism of hot-carrier infrared optoelectronic device is still lacking, and the utilization of this strategy for tailoring infrared response is in its early stages. This review aims to provide a comprehensive overview of the generation, transfer and transport dynamics of hot carriers. Basic principles of hot-carrier conversion in heterostructures are discussed in detail. In addition, progresses of two-dimensional (2D) infrared hot-carrier optoelectronic devices are summarized, with a specific emphasis on photodetectors, solar cells, light-emitting devices and novel functionalities through hot-carrier engineering. Furthermore, challenges and prospects of hot-carrier device towards infrared applications are highlighted.\\n <figure>\\n <div><picture>\\n <source></source></picture><p></p>\\n </div>\\n </figure></p>\",\"PeriodicalId\":48538,\"journal\":{\"name\":\"Infomat\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":22.7000,\"publicationDate\":\"2024-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/inf2.12556\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Infomat\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/inf2.12556\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Infomat","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/inf2.12556","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Hot-carrier engineering for two-dimensional integrated infrared optoelectronics
Plasmonic hot carrier engineering holds great promise for advanced infrared optoelectronic devices. The process of hot carrier transfer has the potential to surpass the spectral limitations of semiconductors, enabling detection of sub-bandgap infrared photons. By harvesting hot carriers prior to thermalization, energy dissipation is minimized, leading to highly efficient photoelectric conversion. Distinguished from conventional band-edge carriers, the ultrafast interfacial transfer and ballistic transport of hot carriers present unprecedented opportunities for high-speed photoelectric conversion. However, a complete description on the underlying mechanism of hot-carrier infrared optoelectronic device is still lacking, and the utilization of this strategy for tailoring infrared response is in its early stages. This review aims to provide a comprehensive overview of the generation, transfer and transport dynamics of hot carriers. Basic principles of hot-carrier conversion in heterostructures are discussed in detail. In addition, progresses of two-dimensional (2D) infrared hot-carrier optoelectronic devices are summarized, with a specific emphasis on photodetectors, solar cells, light-emitting devices and novel functionalities through hot-carrier engineering. Furthermore, challenges and prospects of hot-carrier device towards infrared applications are highlighted.
期刊介绍:
InfoMat, an interdisciplinary and open-access journal, caters to the growing scientific interest in novel materials with unique electrical, optical, and magnetic properties, focusing on their applications in the rapid advancement of information technology. The journal serves as a high-quality platform for researchers across diverse scientific areas to share their findings, critical opinions, and foster collaboration between the materials science and information technology communities.