使用氧化铜纳米粒子和扭曲带增强湍流传热

Q3 Engineering
Ali J. Mohammed, Hussein Hayder Mohammed Ali, Anwar S. Barrak, A. M. Hussein, Murad Ramadan Mohammed
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引用次数: 0

摘要

建立了一个计算模型来研究氧化铜-水纳米流体在水平圆管中的对流传热特性和流体流动特征,旨在为优化此类系统中的传热提供见解。管道中插入了不同扭曲比的扭曲带。在 25,000 W m-2 的均匀热通量条件下,本次定量研究使用了 4,000 至 12,000 的五个雷诺数。所有实验均以单相流体的形式进行,氧化亚铜的体积值分别为 0、0.4、1 和 2%。通过降低扭转比和增加体积浓度,氧化铜-水纳米流体的平均传热系数得到了改善。当扭曲比为 4D 时,最大传热系数比普通管道高出 228%。阶跃比适中的扭曲带会导致摩擦因数增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhancement of turbulent heat transfer by using CuO nano-particle and twisted tape
A computational model is developed to investigate the convective heat transfer properties and the fluid flow characteristics of cupric oxide - water nano-fluid in a horizontal circular pipe aiming to provide insights into optimizing heat transfer in such systems. A twisted tape with varied twist ratios is inserted. This quantitative investigation used five Reynolds number from 4,000 to 12,000 under a uniform heat flux scenario of 25,000 W m−2. All experiments were performed as a single-phase fluid with cupric oxide values of 0, 0.4, 1, and 2% by volume. By reducing the twist ratio and increasing volume concentration, the average heat transfer coefficient of cupric oxide-water nano-fluid was improved. For a twist ratio of 4D, the maximum heat transfer improvement was 228% greater than the plain pipe. The presence of twisted tape with modest step ratios causes the friction factor to grow.
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来源期刊
Pollack Periodica
Pollack Periodica Engineering-Civil and Structural Engineering
CiteScore
1.50
自引率
0.00%
发文量
82
期刊介绍: Pollack Periodica is an interdisciplinary, peer-reviewed journal that provides an international forum for the presentation, discussion and dissemination of the latest advances and developments in engineering and informatics. Pollack Periodica invites papers reporting new research and applications from a wide range of discipline, including civil, mechanical, electrical, environmental, earthquake, material and information engineering. The journal aims at reaching a wider audience, not only researchers, but also those likely to be most affected by research results, for example designers, fabricators, specialists, developers, computer scientists managers in academic, governmental and industrial communities.
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