{"title":"过氧化氢对铜表面化学机械抛光的影响:利用分子动力学模拟和活化能计算探索反应途径","authors":"Hitomi Takahashi, Satoyuki Nomura","doi":"10.2474/trol.19.194","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":0,"journal":{"name":"","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation\",\"authors\":\"Hitomi Takahashi, Satoyuki Nomura\",\"doi\":\"10.2474/trol.19.194\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":0,\"journal\":{\"name\":\"\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0,\"publicationDate\":\"2024-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2474/trol.19.194\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2474/trol.19.194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation