沉积在图案化金属电极上的 Al0.60Sc0.40N 薄膜的压电和弹性特性

M. Liffredo, Nan Xu, Silvan Stettler, Federico Peretti, Luis Guillermo Villanueva
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引用次数: 0

摘要

掺杂 Sc 的氮化铝(AlScN)可用于制造具有较大机电耦合的压电器件,其优点随着薄膜中 Sc 掺杂量的增加而增加。然而,随着 Sc 浓度的增加,工艺窗口也随之缩小,因此有必要对沉积参数进行微调,以获得良好的薄膜。在本文中,我们研究了高掺杂 AlScN(40% Sc)在无图案和有图案金属层上的沉积,以展示如何在金属电极上保持良好的薄膜质量。我们发现金属的高温沉积如何改善 AlScN 薄膜的质量,混合气体如何减少缺陷,以及薄膜质量如何随厚度变化。我们发现,在光刻胶清洗这一看似微不足道的步骤中,必须格外小心。最后,我们从一批制作好的谐振器中提取了优化层的机械、电气和压电特性,与未掺杂 AlN 相比,压电耦合提高了 5 倍,与 32% 掺杂 AlScN 相比,提高了 1.5 倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Piezoelectric and elastic properties of Al0.60Sc0.40N thin films deposited on patterned metal electrodes
Sc-doped aluminum nitride (AlScN) allows for piezoelectric devices with large electromechanical coupling and the benefits increase with larger Sc doping in the film. However, with a larger Sc concentration, the process window narrows, and it is necessary to fine-tune the deposition parameters to achieve a good film. In this paper, we investigate depositions of highly doped AlScN (40% Sc) on unpatterned and patterned metal layers, to show how it is possible to maintain a good film quality on a metal electrode. We find how high-temperature deposition of the metal improves the AlScN film quality, how the gas mixture allows to reduce defects, and how film quality changes with thickness. We show that extreme care must be taken in the apparently trivial step of photoresist cleaning. Finally, we extract the mechanical, electrical, and piezoelectric properties of our optimized layer from a batch of fabricated resonators, obtaining a 5× improvement of piezoelectric coupling compared to undoped AlN and a 1.5× improvement from 32% doped AlScN.
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