微电子学中生物材料界面的机械表征技术进展和环境影响:文献综述

Renato A. Ferreira, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, Lucas F. M. da Silva
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摘要

为满足集成电路 (IC) 和微机电系统 (MEMS) 的性能要求,芯片封装工程发生了巨大变化。封装层主要由金属、陶瓷、钛、铌、钽、铌...
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review
Chip packaging engineering has evolved significantly to meet the performance demands of integrated circuits (IC) and micro-electromechanical systems (MEMS). Layers, mainly composed of metals, ceram...
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