尺寸对旋光分解的影响

IF 1.9 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Modelling and Simulation in Materials Science and Engineering Pub Date : 2024-05-09 DOI:10.1088/1361-651x/ad4408

George Petsos

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引用次数: 0

摘要

我们研究了晶粒尺寸对多晶相干二元固溶体稳定性的影响。通过假设晶粒是各向同性的，我们发现随着晶粒半径的减小，不稳定性趋势也会减小。我们还发现，存在一个与温度相关的临界晶粒半径，在此半径以下，不稳定趋势消失，并且对于任何初始成分，晶粒在无限小的成分波动下都是稳定的。我们发现临界晶粒半径随着温度的降低而单调减小。如果晶粒半径小于最小临界晶粒半径，则晶粒在任何温度和初始成分下都是稳定的。

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Size effects on spinodal decomposition

We examine the influence of grains size on the stability of polycrystalline coherent binary solid solutions. By assuming that the grains are isotropic, we find that the tendency for instability decreases as the radius of the grains decrease. We also find that a temperature-dependent critical grain radius exists below which the tendency for instability vanishes and the grains are stable, with respect to infinitesimal composition fluctuations, for any initial composition. We find that the critical grain radius decreases monotonically as the temperature decrease. If the radius of the grains is smaller than the minimum critical grain radius the grains are stable for any temperature and initial composition.

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来源期刊

Modelling and Simulation in Materials Science and Engineering 工程技术-材料科学：综合

CiteScore

3.30

自引率

5.60%

发文量

审稿时长

1.7 months

期刊介绍： Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation. Subject coverage: Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.