Zhaoxuan Cui, Xin Lin, Jianying Zhong, Yongqi Yao, Jianyuan Xu, Zhijun Wang, Hao Zhang
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{"title":"6σ 基于绝缘、电流和机械应力协同模拟的 GIL/GIS 总线稳健轻量化设计","authors":"Zhaoxuan Cui, Xin Lin, Jianying Zhong, Yongqi Yao, Jianyuan Xu, Zhijun Wang, Hao Zhang","doi":"10.1002/tee.24083","DOIUrl":null,"url":null,"abstract":"<p>GIL/GIS bus is widely used in the field of power transmission and distribution, and the demand for lightweight is becoming more and more prominent. To reduce the weight of the bus and ensure the safety and reliability of the structure, a new 6<i>σ</i> robust design method of the GIL/GIS bus based on electric-thermal-mechanical co-simulation is proposed. Taking a 550 kV/5000A bus as the initial structure, considering the uncertainty of product size and performance, a 6<i>σ</i> robust lightweight model of bus insulation electric field strength, current temperature rise, and mechanical stress multi-performance co-simulation is established. The finite element numerical calculation method is used to calculate and analyze the performance parameters of the bus. The Kriging surrogate model is used to form the response surface, and the optimal bus structure is obtained by genetic algorithm. The results show that after the robustness optimization, the performance of the bus meets the design requirements, the weight per meter decreased from 65.11 to 39.12 kg, and the lightweight effect is remarkable. Compared with the traditional deterministic optimization design, the reliability of the structure is improved. The new method of the GIL/GIS bus lightweight design proposed in this study has high feasibility and application prospects, which can provide new ideas for the development of gas-insulated electrical equipment. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.</p>","PeriodicalId":13435,"journal":{"name":"IEEJ Transactions on Electrical and Electronic Engineering","volume":"19 8","pages":"1289-1299"},"PeriodicalIF":1.0000,"publicationDate":"2024-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"6σ Robust Lightweight Design of the GIL/GIS Bus Based on Co-Simulation of Insulation, Current Flow, and Mechanical Stress\",\"authors\":\"Zhaoxuan Cui, Xin Lin, Jianying Zhong, Yongqi Yao, Jianyuan Xu, Zhijun Wang, Hao Zhang\",\"doi\":\"10.1002/tee.24083\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>GIL/GIS bus is widely used in the field of power transmission and distribution, and the demand for lightweight is becoming more and more prominent. To reduce the weight of the bus and ensure the safety and reliability of the structure, a new 6<i>σ</i> robust design method of the GIL/GIS bus based on electric-thermal-mechanical co-simulation is proposed. Taking a 550 kV/5000A bus as the initial structure, considering the uncertainty of product size and performance, a 6<i>σ</i> robust lightweight model of bus insulation electric field strength, current temperature rise, and mechanical stress multi-performance co-simulation is established. The finite element numerical calculation method is used to calculate and analyze the performance parameters of the bus. The Kriging surrogate model is used to form the response surface, and the optimal bus structure is obtained by genetic algorithm. The results show that after the robustness optimization, the performance of the bus meets the design requirements, the weight per meter decreased from 65.11 to 39.12 kg, and the lightweight effect is remarkable. Compared with the traditional deterministic optimization design, the reliability of the structure is improved. The new method of the GIL/GIS bus lightweight design proposed in this study has high feasibility and application prospects, which can provide new ideas for the development of gas-insulated electrical equipment. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.</p>\",\"PeriodicalId\":13435,\"journal\":{\"name\":\"IEEJ Transactions on Electrical and Electronic Engineering\",\"volume\":\"19 8\",\"pages\":\"1289-1299\"},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2024-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEJ Transactions on Electrical and Electronic Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/tee.24083\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEJ Transactions on Electrical and Electronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/tee.24083","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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