粒度对单层刨花板力学性能的影响

Fibers Pub Date : 2024-04-02 DOI:10.3390/fib12040032
Nick Engehausen, J. Benthien, Jan Lüdtke
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引用次数: 0

摘要

虽然大多数影响刨花板机械性能的因素似乎都已得到研究,但由于缺乏合适的颗粒测量技术,人们对颗粒大小或颗粒尺寸的影响还缺乏了解。激光三维扫描技术的引入使自动测定颗粒的尺寸、表面积和体积成为可能。本研究调查了颗粒尺寸对刨花板机械性能的影响。为了隔离潜在的重叠影响因素,我们制作并分析了具有均匀密度轮廓的单层刨花板。通过对表面区域进行三维扫描,调整了(细)面层颗粒和(粗)芯层颗粒表面特有的粘合剂量,以确保在颗粒尺寸发生变化时仍具有可比性。研究发现,随着颗粒尺寸的增大,断裂模量(MOR)和弹性模量(MOE)会增大,而内部粘接强度(IB)会减小。研究考虑了这些影响是否是由于木板中颗粒的取向与颗粒大小有关。此外,研究还表明,所有上述特性都会随着表面特定粘合剂用量的增加而增加。本文还提供了一些实例,以说明如何利用这些基本关系来改进刨花板的生产工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Particle Size on the Mechanical Properties of Single-Layer Particleboards
While most of the influences on the mechanical properties of particleboard appear to have been investigated, there is a lack of knowledge about the influence of particle size or particle dimensions due to the absence of a suitable particle measuring technique. The introduction of laser-based 3D scanning technology makes it possible to automatically determine the dimensions, surface area, and volume of particles. In this study, the influence of particle size on the mechanical properties of particleboards was investigated. To isolate potentially overlapping influences, single-layer particleboards with a uniform density profile were produced and analyzed. The amount of adhesive specific to the surface of the (fine) face layer particles and (coarse) core layer particles was adjusted utilizing 3D scanning of the surface areas to ensure comparability despite changes in particle size. It was found that with increasing particle size, the modulus of rupture (MOR) and modulus of elasticity (MOE) increase, while the internal bond strength (IB) decreases. It is considered whether these effects result from a particle-size-dependent orientation of the particles in the board. Furthermore, it is shown that all the aforementioned properties increase with increasing surface-specific adhesive amounts. Examples are provided to demonstrate how such fundamental relationships can be utilized to enhance the particleboard production process.
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