R. Muhida, Muhammad Riza, Bambang Pratowo, Zein Muhamad, A. Cucus, Ari Kurniawan, Tia Tanjung, Taqwan Thamrin, A. Sutjipto, R. Muhida
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引用次数: 0
摘要
本研究采用透射电子显微镜 (TEM) 方法分析了置于纹理基底上的多晶硅的结晶度劣化情况。在纹理基底上,我们制作了粗糙度 RMS σ 为 64 nm 的多晶硅光伏薄膜。根据 TEM 的研究结果,我们发现在粗糙度均方根 σ 为 64 纳米的纹理基底上沉积的多晶硅光伏层中存在生长碰撞。柱状晶粒的生长方向倾向于垂直于纹理基底的斜坡。在纹理基底的 V 形结构中,可以清楚地看到对角线方向的柱状生长碰撞。碰撞还产生了空洞和裂缝。碰撞还产生了空腔和裂缝。根据 TEM 和 SAED 照片,与在Λ形结构上生长的多晶硅相比,在 V 形结构上生长的多晶硅的结晶度有所下降。
Transmission Electron Microscope Analysis of Polycrystalline Silicon for Thin Film Solar Cells
This research uses a transmission electron microscopy (TEM) approach to analyze the deterioration of the crystallinity of poly-Si placed on the textured substrate. On the textured substrate, we created a poly-Si photovoltaic film with a RMS roughness, σ of 64 nm. Based on TEM findings, we discovered that growth collisions are present in the poly-Si photovoltaic layer that was deposited on the textured substrate with an RMS roughness, σ of 64 nm. The growth direction of the columnar-like grains tends to be perpendicular to the slant slope of the textured substrate. The diagonally oriented columnar growth collisions may be seen clearly at V-shaped formations in the textured substrate. There are also cavities and fissures that were created by the collisions. There are also cavities and fissures that were created by the collisions. The crystallinity of poly-Si grown above the V-shape structure has worsened, as compared to poly-Si grown above the Λ-shape structure, according to the TEM and SAED pictures.