{"title":"新型热变形自稳定柔性连接机制","authors":"Fahui Feng, Zhihang Lin, Hui Tang","doi":"10.3390/act13040146","DOIUrl":null,"url":null,"abstract":"In micro-LED chip repair, a nanopositioner is commonly used to adjust the positioning of the LED chip. However, during the bonding process, the heat generated can cause the positioning system to deform, leading to inaccurate alignment and poor-quality chip repair. To solve this issue, a novel flexible connection structure has been proposed that can eliminate thermal deformation. The principle of this novel flexible connection structure is that the thermal distortion self-elimination performance is achieved via three flexible connection modules (FCM) so that the thermal stress is automatically eliminated. First, the paper introduces the principle of thermal deformation elimination, and then the design and modeling process of the proposed structure are described. A heat transfer model is then developed to determine how temperature is distributed within the structure. A thermal deformation model is established, and the size of the FCM is optimized using a genetic algorithm (GA) to minimize the thermal deformation. Finite element analysis (FEA) is used to simulate and evaluate the thermal distortion self-elimination performance of the optimized mechanism. Finally, experiments are conducted to verify the reliability and accuracy of the simulation results. The simulations and experiments show that the proposed structure can eliminate more than 38% of the thermal deformation, indicating an excellent thermal deformation self-eliminating capability.","PeriodicalId":48584,"journal":{"name":"Actuators","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2024-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism\",\"authors\":\"Fahui Feng, Zhihang Lin, Hui Tang\",\"doi\":\"10.3390/act13040146\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In micro-LED chip repair, a nanopositioner is commonly used to adjust the positioning of the LED chip. However, during the bonding process, the heat generated can cause the positioning system to deform, leading to inaccurate alignment and poor-quality chip repair. To solve this issue, a novel flexible connection structure has been proposed that can eliminate thermal deformation. The principle of this novel flexible connection structure is that the thermal distortion self-elimination performance is achieved via three flexible connection modules (FCM) so that the thermal stress is automatically eliminated. First, the paper introduces the principle of thermal deformation elimination, and then the design and modeling process of the proposed structure are described. A heat transfer model is then developed to determine how temperature is distributed within the structure. A thermal deformation model is established, and the size of the FCM is optimized using a genetic algorithm (GA) to minimize the thermal deformation. Finite element analysis (FEA) is used to simulate and evaluate the thermal distortion self-elimination performance of the optimized mechanism. Finally, experiments are conducted to verify the reliability and accuracy of the simulation results. The simulations and experiments show that the proposed structure can eliminate more than 38% of the thermal deformation, indicating an excellent thermal deformation self-eliminating capability.\",\"PeriodicalId\":48584,\"journal\":{\"name\":\"Actuators\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Actuators\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.3390/act13040146\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Actuators","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/act13040146","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
摘要
在微型 LED 芯片修复中,通常使用纳米定位器来调整 LED 芯片的位置。然而,在粘接过程中,产生的热量会导致定位系统变形,从而导致对准不准和芯片修复质量低下。为了解决这个问题,我们提出了一种新型柔性连接结构,它可以消除热变形。这种新型柔性连接结构的原理是通过三个柔性连接模块(FCM)实现热变形自消除性能,从而自动消除热应力。本文首先介绍了消除热变形的原理,然后描述了拟议结构的设计和建模过程。然后建立传热模型,以确定结构内部的温度分布。建立热变形模型,并使用遗传算法(GA)优化 FCM 的尺寸,以最大限度地减小热变形。有限元分析(FEA)用于模拟和评估优化机构的热变形自消除性能。最后,通过实验验证了仿真结果的可靠性和准确性。模拟和实验结果表明,所提出的结构可以消除 38% 以上的热变形,表明其具有出色的热变形自消除能力。
A Novel Thermal Deformation Self-Stabilization Flexible Connection Mechanism
In micro-LED chip repair, a nanopositioner is commonly used to adjust the positioning of the LED chip. However, during the bonding process, the heat generated can cause the positioning system to deform, leading to inaccurate alignment and poor-quality chip repair. To solve this issue, a novel flexible connection structure has been proposed that can eliminate thermal deformation. The principle of this novel flexible connection structure is that the thermal distortion self-elimination performance is achieved via three flexible connection modules (FCM) so that the thermal stress is automatically eliminated. First, the paper introduces the principle of thermal deformation elimination, and then the design and modeling process of the proposed structure are described. A heat transfer model is then developed to determine how temperature is distributed within the structure. A thermal deformation model is established, and the size of the FCM is optimized using a genetic algorithm (GA) to minimize the thermal deformation. Finite element analysis (FEA) is used to simulate and evaluate the thermal distortion self-elimination performance of the optimized mechanism. Finally, experiments are conducted to verify the reliability and accuracy of the simulation results. The simulations and experiments show that the proposed structure can eliminate more than 38% of the thermal deformation, indicating an excellent thermal deformation self-eliminating capability.
期刊介绍:
Actuators (ISSN 2076-0825; CODEN: ACTUC3) is an international open access journal on the science and technology of actuators and control systems published quarterly online by MDPI.