基于顶视 SEM 图像重建三维轮廓的方法

Shuang Liu, Ge Liu, Hao Shen, Dinghai Rui, Libin Zhang, Yayi Wei
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引用次数: 0

摘要

在集成电路领域,电子束图像可以提供线宽和线间距等工艺参数信息。然而,这些尺寸信息只占图像所能提供信息的一小部分。为了最大限度地利用电子束图像所提供的信息,本文提出了一种基于电子束成像模型的三维重建方法。该方法揭示了顶视扫描电子显微镜(SEM)图像与实际三维结构之间的关系。然后,采用迭代优化方法对模型和结构参数进行优化,以实现三维重建。在优化过程中,实际 SEM 图像与重建图像之间的相关性被用来建立成本函数。两微米硅结构、垂直边缘和圆形侧壁结构被应用于模型验证。结果表明,提出的模型拟合相关性超过 99.3%,边缘角度不匹配度在 1° 以内,在重建这两种结构方面表现良好。我们的方法使高精度三维轮廓计量和缺陷检测成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Method to reconstruct three-dimensional profile based on top-view SEM images
In the field of integrated circuits, electron beam images can provide process parameter information such as linewidth and line spacing. However, this size information only accounts for a small proportion of the information that the image can provide. To maximize the information obtained from electron beam images, this paper proposes a three-dimensional reconstruction method based on the electron beam imaging model. This method reveals the relationship between the top-view scanning electron microscopy (SEM) image and the actual three-dimensional structure. And then, an iterative optimization method is used to optimize the model and structure parameters for 3D reconstructions. During optimization flow, the correlation between the real SEM image and the reconstructed image is used to build the cost function. Two-micrometer silicon structures, vertical edge, and rounded sidewall structures are applied to model verification. Results show that the proposed model, with a fitting correlation over 99.3% and edge-angle mismatch within 1°, does well in rebuilding both structures. Our method makes it possible for high-precision 3D profile metrology and defect inspection.
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