铜带滑动行为和残余应力的准原位研究

Metals Pub Date : 2024-04-23 DOI:10.3390/met14050491
Yahui Liu, Qianqian Zhu, Yanjun Zhou, Kexing Song, Xiaokang Yang, Jing Chen
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引用次数: 0

摘要

集成电路引线框架的制备方法已从冲压过渡到蚀刻,使其对残余应力更加敏感。因此,残余应力导致的尺寸偏差变得更加明显,有必要对铜带加工过程进行深入研究,特别是考虑到引线框架的高精度要求。我们采用了一种准原位方法来监测变形过程,并对残余应力进行了定量分析和图形重构。结果表明,取向演变与晶粒尺寸或晶粒长宽比没有明显的相关性。然而,不同晶粒的储能与其取向有关。对滑移轨迹的进一步分析表明,单个或多个滑移可能会在晶粒细分中被激活,而 Schmid 因子差异比 (SFDR) 值被证明是分析这种变形模式的有效工具。更有趣的发现是,变形模式直接影响局部区域的残余应力分布。本研究进一步分析了残余应力、施密特因子和 SFDR 之间的关系,发现 SFDR 与残余应力之间存在明显的相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip
The preparation method of integrated circuit lead frames has transitioned from stamping to etching, rendering them more sensitive to residual stress. Consequently, the dimensional deviations caused by residual stress become more pronounced, necessitating a thorough investigation into the copper strip processing process, particularly considering the high-precision requirements of the lead frame. A quasi in situ method was employed to monitor the deformation process, and quantitative analyses and graphical reconstructions of the residual stress were conducted. The results indicated that the orientation evolution did not exhibit a significant correlation with grain size or grain aspect ratio. However, the stored energy of the different grains was related to their orientations. Further analysis of slip traces revealed that single or multiple slipping may be activated in grain subdivisions, and the Schmid factor difference ratio (SFDR) value proved to be an effective tool for analyzing this deformation mode. An even more interesting finding was that the deformation mode directly affected the residual stress distribution in local regions. The relationship between residual stress, Schmid factor, and SFDR was further analyzed, and a clear correlation between SFDR and residual stress was found in this study.
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