{"title":"高精度多光束掩模制造热分析","authors":"Yanjun Zhang, Kaijun Dong, Zhuming Liu, Delong Chen","doi":"10.1116/6.0003477","DOIUrl":null,"url":null,"abstract":"For a 7 nm technology node and beyond, multi-beam mask fabrication based on charged particles has attracted attention widely and shows great advantages in terms of throughput. However, the heating effect during mask writing is a serious problem and makes deformation error. To address this issue, an accurate analysis of heating with multi-beam writing is necessary. In this study, the thermal effects of electron beams on a mask during writing time (exposure time and nonexposure time) were simulated with a finite element numerical method. The variation in the temperature field with two writing paths (S-shaped and E-shaped) was analyzed. A comparative analysis of the mask’s deformation under different writing paths was conducted. Numerical research shows that the thermal analysis method in this study provides a guide for optimizing the process parameters of mask fabrication.","PeriodicalId":282302,"journal":{"name":"Journal of Vacuum Science & Technology B","volume":"57 9","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal analysis with high accuracy of multi-beam mask fabrication\",\"authors\":\"Yanjun Zhang, Kaijun Dong, Zhuming Liu, Delong Chen\",\"doi\":\"10.1116/6.0003477\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For a 7 nm technology node and beyond, multi-beam mask fabrication based on charged particles has attracted attention widely and shows great advantages in terms of throughput. However, the heating effect during mask writing is a serious problem and makes deformation error. To address this issue, an accurate analysis of heating with multi-beam writing is necessary. In this study, the thermal effects of electron beams on a mask during writing time (exposure time and nonexposure time) were simulated with a finite element numerical method. The variation in the temperature field with two writing paths (S-shaped and E-shaped) was analyzed. A comparative analysis of the mask’s deformation under different writing paths was conducted. Numerical research shows that the thermal analysis method in this study provides a guide for optimizing the process parameters of mask fabrication.\",\"PeriodicalId\":282302,\"journal\":{\"name\":\"Journal of Vacuum Science & Technology B\",\"volume\":\"57 9\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-04-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Vacuum Science & Technology B\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1116/6.0003477\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science & Technology B","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0003477","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
对于 7 纳米及更高的技术节点,基于带电粒子的多光束掩膜制造已引起广泛关注,并在产量方面显示出巨大优势。然而,掩膜写入过程中的加热效应是一个严重问题,会导致变形误差。为解决这一问题,有必要对多光束写入时的加热进行精确分析。本研究采用有限元数值方法模拟了光罩在写入过程中(曝光时间和非曝光时间)的电子束热效应。分析了两种写入路径(S 形和 E 形)的温度场变化。对不同书写路径下的掩膜变形进行了比较分析。数值研究表明,本研究中的热分析方法为优化掩膜制造工艺参数提供了指导。
Thermal analysis with high accuracy of multi-beam mask fabrication
For a 7 nm technology node and beyond, multi-beam mask fabrication based on charged particles has attracted attention widely and shows great advantages in terms of throughput. However, the heating effect during mask writing is a serious problem and makes deformation error. To address this issue, an accurate analysis of heating with multi-beam writing is necessary. In this study, the thermal effects of electron beams on a mask during writing time (exposure time and nonexposure time) were simulated with a finite element numerical method. The variation in the temperature field with two writing paths (S-shaped and E-shaped) was analyzed. A comparative analysis of the mask’s deformation under different writing paths was conducted. Numerical research shows that the thermal analysis method in this study provides a guide for optimizing the process parameters of mask fabrication.