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关于 SAC305 焊点电迁移行为的现场实验和模拟研究

IF 2.7 4区 材料科学 Q3 ENGINEERING, CHEMICAL
Journal of Adhesion Science and Technology Pub Date : 2024-04-01 DOI:10.1080/01694243.2024.2336177
Yang Liu, Xin Xu, Yuxiong Xue, Chaoyang Xing
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引用次数: 0

摘要

随着电子设备中电流密度的增加，电迁移已成为影响焊点可靠性的一个重要因素。在这项研究中，电迁移的特征是在焊点上的电流密度。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
As the current density increases in electronic devices, electromigration has become a significant factor affecting the reliability of solder joints. In this study, the electromigration characterist...
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来源期刊
Journal of Adhesion Science and Technology
Journal of Adhesion Science and Technology 工程技术-材料科学：综合
CiteScore
5.10
自引率
13.00%
发文量
136
审稿时长
4.1 months
期刊介绍： Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.
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