用硅酸钠树脂生产胶体二氧化硅及优化工艺

Buse Akkaya, Jiyan Aslan, Rukiye Taşdemi̇r, İlker Erdem, Mehmet Gönen
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引用次数: 0

摘要

胶体二氧化硅是无定形二氧化硅(SiO2)纳米粒子在水中稳定而均匀的分散形式。胶体二氧化硅具有表面积大、生物相容性好、毒性低、化学和热稳定性高等特点,一直是研究的重点。它已被广泛应用于各种工业领域,包括纸浆和造纸、色谱、电子、食品、胶体以及陶瓷和玻璃工业。本研究使用阳离子树脂和硅酸钠生产胶体二氧化硅,并对工艺条件进行了优化。温度(50-80 °C)、搅拌速度(200-500 转/分钟)和时间(20-120 分钟)对粒度有显著影响,因此被选为参数。对胶体二氧化硅颗粒进行了粒度分布(PSD)分析,以确定适当的参数水平。最合适的工艺条件是 50°C 温度、40 分钟和 300 转/分钟。经测量,在最佳条件下生产的胶体二氧化硅的平均粒径为 80 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Colloidal Silica Production with Resin from Sodium Silicate and Optimization of Process
Colloidal silica is a stable and homogeneously dispersed form of amorphous silicon dioxide (SiO2) nanoparticles in water. Colloidal silica has been the focus of research due to large surface area, biocompatibility, low toxicity and chemical and thermal stability. It has been used in a wide variety of industrial applications, including pulp and paper, chromatography, electronics, foods, and colloids, as well as in the ceramics and glass industry. In this study, colloidal silica was produced using cationic resin and sodium silicate and process conditions were optimized. Temperature (50-80 °C), mixing speed (200-500 rpm) and time (20-120 min.), which significantly affect the particle size, were selected as parameters. Particle size distribution (PSD) analyzes of colloidal silica particles were performed to determine appropriate levels of the parameters. The most suitable process conditions are 50°C temperature, 40 min. and 300 rpm. The average particle size of colloidal silica produced in optimum conditions was measured as 80 nm.
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