方形发光二极管阵列的热管理:建模和参数分析

IF 1.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
M. B. Ben Hamida
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引用次数: 0

摘要

目的本研究调查了三个参数(如 LED 芯片数量、间距和 LED 功率)对使用根据较低温度选择的最佳散热器配置的 LED 结温的影响。为确定散热器的最佳配置,在 Comsol Multiphysics 中对 10 种不同配置进行了数值研究。选择结温最低的配置进行进一步分析。然后改变 LED 芯片数量、间距和 LED 功率,以确定该散热器的最佳配置。在矩形散热器的 10 种配置中,我们推断出最佳配置对应于第一种设计,其宽度为 1 毫米,高度为 0.5 毫米,长度为 45 毫米。对于功率为 50 W-200 W 的 LED,当 LED 芯片数量减少、间距减小时,平均温度会下降。事实上,最佳的阵列 LED 是 64 个 LED 芯片和 0.5 毫米的间距。此外,还确定了平均温度与 LED 芯片数量、LED 间距和功率(降低结点温度的关键因素)的泛函关系式。采用数值模拟方法研究这三个因素的影响,比实验方法更准确、更可靠。该研究考虑了这三个因素的各种数值,从而更全面地了解了它们的影响。它推导出了 LED 平均温度的一般公式,可用于设计具有理想结温的 LED 阵列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal management of square light emitting diode arrays: modeling and parametric analysis
PurposeThis study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.Design/methodology/approachTo determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.FindingsAmong 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.Originality/valueThe study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.
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来源期刊
CiteScore
3.70
自引率
5.00%
发文量
60
期刊介绍: Multidiscipline Modeling in Materials and Structures is published by Emerald Group Publishing Limited from 2010
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