大电流脉冲电子束辐照诱导铜-钼合金的微观结构和更佳性能

Fangqiang Guo, Conglin Zhang, Jintong Guan, Chengjian Ma, Zirun Yang, Qingfeng Guan
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引用次数: 0

摘要

本文利用大电流脉冲电子束(HCPEB)辐照技术制备了具有更好性能的铜钼合金层。通过 X 射线衍射、扫描电子显微镜和透射电子显微镜研究了改性层的微观结构。同时还测量了微硬度和摩擦性能。经 HCPEB 辐照后,铜钼合金表面产生了纳米钼颗粒、固溶体和长周期超晶格结构,并形成了缺陷结构。这些微结构显著提高了表面硬度。滑动磨损测试结果表明,与初始样品相比,经过 HCPEB 辐照的样品具有更好的性能,这归功于超细 Mo 粒子和硬化的表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microstructures and improved properties of Cu–Mo alloys induced by high current pulsed electron beam irradiation
In this paper, a Cu–Mo alloying layer with improved properties was fabricated by high current pulsed electron beam (HCPEB) irradiation. The microstructure of the modified layer was investigated by x-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The microhardness and friction properties were also measured. After HCPEB irradiation, nano Mo particles, solid solution, and long-period superlattice structures were generated on the surface of Cu–Mo alloys, together with the formation of defect structures. These microstructures led to a significant increase in the surface hardness. The results of sliding wear tests indicated that the HCPEB-irradiated samples exhibited better properties compared with the initial one, which was attributed to the ultrafine Mo particles and the hardened surface.
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